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Used Grinding, Lapping & Polishing

55 results
1

AR Coating system Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)

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Brand Sanritsu Glass/Sapphire/ceramic/Si High speed automatic circular part edge grinding machine: Made in J... Year(s) : 2012 Location : EUROPE (Western and Northern)

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In good working condition ex works Asia Year(s) : 2001 Location : EUROPE (Western and Northern)

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Fujikoshi Double sided Polisher Year(s) : 2003, 2004 Location : EUROPE (Western and Northern)

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Improved yield In-line system Environmentally friendly process Easy operation Year(s) : 2005 Location : EUROPE (Western and Northern)

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Wafer Size: 300mm Year(s) : 2001, 2004 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Cassette to Cassette YES Other Info... Year(s) : 2004 Location : EUROPE (Western and Northern)

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- 3 Spindle configuration - 4 Chuck Table configuration - Handling and processing for 200mm dicing frames - To... Year(s) : 2020 Location : AMERICA North (USA-Canada-Mexico)

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Specifications: Resolution: 1µm Full range accuracy (at 20°C): 3µm over 25mm Max allowable preset value:... Location : AMERICA North (USA-Canada-Mexico)

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Description: Plunge Grinder Other Information Variable Speed Power Requirements 208 V 20.0 A 60 Hz... Location : AMERICA North (USA-Canada-Mexico)

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Description: Ring offset: 9/16" Spindle torque: 1700 in/lbs Spindle load rating: 1050 lbs. Push button reset... Year(s) : 1994 Location : AMERICA North (USA-Canada-Mexico)

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Description Single Sided Lapping Machine Plate Diameter 20.00 in (50.80 cm) Plate Thickness 2.00 in (... Location : AMERICA North (USA-Canada-Mexico)

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Specifications: Workpiece material: Glass Max substrate: 300mm X Axis Specifications: Stroke: 300mm S... Location : AMERICA North (USA-Canada-Mexico)

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General Specifications: Table diameter: 300mm Max. workpiece size: 400mm dia x 200mm H Table revolution speed:... Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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Speed range: 6000 to 18000rpm Feed size: up to 10mm Final fineness: <40μm (based on feed material)... Location : AMERICA North (USA-Canada-Mexico)

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Fully-Auto LED Wafer Prober Year(s) : 2011 Location : ASIA (North East)

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SW-08 Year(s) : 2010 Location : ASIA (North East)

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Wafer Polishing Machine Year(s) : 2011 Location : ASIA (North East)

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GAN Grind Machine Year(s) : 2012 Location : ASIA (North East)

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Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Cassette to Cassette YES Condition... Location : EUROPE (Western and Northern)

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Semi-Automatic Grinder Polisher Location : AMERICA North (USA-Canada-Mexico)

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DFG-83H/6 Description Back side grinder Year(s) : 1994 Location : ASIA (North East)

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24B Description Polisher Year(s) : 2000 Location : ASIA (North East)

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TISI ID 150901-48 Manufacturer Semitool Model Spectral Description Poly Strip Wafer Size 200mm Vinta... Location : ASIA (North East)

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TISI ID 150917-200 Manufacturer DISCO Model DFG8140 Description Back side polisher DFG8140 Wafer Size... Location : ASIA (North East)

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You can find used Grinding, Lapping & Polishing on Wotol

The main manufacturers of Grinding, Lapping & Polishing are Disco, Strasbaugh, Speedfam, Logitech, Lapmaster, Semitool, Buehler, Ebara, Okamoto, Peter Wolters, AMAT, Harig, Premier Mill, Struers, ABB, Advanced Imaging, Branson / IPC, DNS, DS Precision, Fujikoshi, GMN, Leco, NEWLONG, Nitto, Polyflow, Schmoll, Seiko Instruments, Telmec , Ultron

The main model Polyflow S412, HR8500-II, 6EC, 7AA,EPD 300X, Harig EZ SURF, SSG 800 HT, 6DF-SP, 15, UH114, SL13.6, MPS 400, MK II-8, S-LM-116G, OFL-11, Q150GB , 24B, PP5, 1010, Mirra OnTrak, ST260D, DFP8140, S16B, GNX-300, DFG840HS, Rotopol 21,12, MiniMet, Mill NETZSCH, SG-1000HR, 10” web coating.

HS Code 8486 10 50  for Grinding, polishing and lapping machines for processing of semiconductor wafers 

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