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Used Semiconductor Equipment

3,464 results
1

Manufacturer: Bondztek Model: Bondztek Wafer Mount Wafer Ring Mounter to foton ring Location : EUROPE (Western and Northern)

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Complete condition but HDD was removed by former end user See Config file attached Year(s) : 2009 Location : EUROPE (Western and Northern)

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Semitool Alpha production wet processing system OEM = Semitool Model = CP04MNSPD0801 (Alpha) Condition: Used Year(s) : 2009 Location : EUROPE (Western and Northern)

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Brand Sanritsu Glass/Sapphire/ceramic/Si High speed automatic circular part edge grinding machine: Made in J Year(s) : 2012 Location : EUROPE (Western and Northern)

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In good working condition ex works Asia Year(s) : 2001 Location : EUROPE (Western and Northern)

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Includes: Brush Box Refurbishment, Chemical line replacement, full cleaning and replacement of all wear items Location : EUROPE (Western and Northern)

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This OAI Optical Associates 804MBA-086265 Front and Backside Mask Aligner looks to be in good cosmetic condit Location : EUROPE (Western and Northern)

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Specification : Wafer Size: 200mm Robot: HP(buffer and Transfer) Loadlock: Narrow Bod Location : EUROPE (Western and Northern)

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Laser Mark Location : EUROPE (Western and Northern)

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2007IC8 Die Bonder Location : EUROPE (Western and Northern)

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Bond Tester with BS5Kg Module Year(s) : 2015 Location : EUROPE (Western and Northern)

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Equipped with two valves DJ9500+ NJ8 Year(s) : 2015 Location : EUROPE (Western and Northern)

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Bonder Year(s) : 2011 Location : EUROPE (Western and Northern)

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Wafer size: 300mm Process: CVD Year(s) : 2010 Location : EUROPE (Western and Northern)

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CVD Tool with 4 Chambers 2 Chambers Etch, 2 Chambers CVD SILAN Location : EUROPE (Western and Northern)

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EM343 WAFER SIZE 12 Year(s) : 2007 Location : EUROPE (Western and Northern)

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WAFER SIZE 12 Year(s) : 2000 Location : EUROPE (Western and Northern)

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2006HR Die Bonder Location : EUROPE (Western and Northern)

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2008HL Die Bonder Location : EUROPE (Western and Northern)

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2008SC3 Plus Smart Card Die Bonder Location : EUROPE (Western and Northern)

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2008XP3 Die Bonder Location : EUROPE (Western and Northern)

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WAFER SIZE 6 Year(s) : 1995 Location : EUROPE (Western and Northern)

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1

3100 Plus Gold Wire Bonder Location : EUROPE (Western and Northern)

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1

6400 Aluminium Wire Bonder Location : EUROPE (Western and Northern)

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1

Fixed Binocular Head U-BI30 Pair of WHN10x/22 Eyepieces (one adjustable). Fixed Stage with Right Hand Coaxial Location : EUROPE (Western and Northern)

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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