ADE MicroSense 6300

Specifications:

• Bench top programmable accurate thickness and thickness variation (TTV) measurement system
• Wafer capability from 3" to 12" inch wafers
• Manual load system
• Non-contact probe
• Wafer thickness range: 300um to 1000um
• Thickness Accuracy: +0.25 micrometers @ 25°C
• Thermal Stability: 0.5 micrometers per degree C
• Thickness Resolution: 0.01 micrometers
• Thickness Repeatability: +0.1 micrometers @ 25°C (subject to manual repositioning)
• Operating Temperature Range: 20 to 30°C
• Built-in RS232
• Facility Requirements: Voltage: 100 – 240 VAC, Frequency: 50/60 Hz, Power 40 Watts
• System refurbished to meet OEM specification