Delvotec 6200 Gold Ball Wire Bonder

Version: Assembly
Vintage: 01.06.2007

REFURBISHED AND CHECKED BY A SPECIALIST ENGINEER.
Full automatic Goldball Wirebonder for
fine wire MCM and Hybrid Applications.
The 6200 family of machines was developed from
the successful 6100 series of thermosonic gold ball bonders and
offers the best choice for a wide range of commercially and
strategically important applications where
a truly universal bonder is required.
Linear motor drive systems allow fast,
smooth-running operation with accuracy and
repeatability in a small footprint.
• X/Y2 motion contained in the head enables rigid clamping of
device and simpler design of automatic handling systems
• Pentium TM processor with UNIX based operating system
and full network capability
• The basic machine is configured for an 8" x 6" bond area
• All machines use a process tolerant,
grey-level pattern recognition system from Cognex
• Red and white light sources available with direct,
oblique and diffuse lighting
• Programmable piezo-technology controlled wire
clamp unit allows better process control
• Programmable bond weight controlled by linear motor system
• Over 10,000 wires and 200 dice in a single programme
• Step and repeat capability for modular programming
• Component handling can be manual, semi-automatic,
fully automatic magazine-to-magazine or with
an in-line link to conveyor systems
The family concept with a common hardware and
software base allows retrofit of all options at
any time but keeps the cost of the initial investment down to
an absolute minimum.

Specifications
Bond area 200 x 150mm
Z-range 20mm
Wire diameter 17 to 50um
Wire feed 2" spool
Ultrasonic system 60kHz or 100kHz
Pattern recognition travelling CCD camera and Cognex
Lighting 3 channels, direct, indirect and side light
Wire count > 10,000
Die count 200 standard

Control
Pentium processor with UNIX-based operating system
Programme storage Hard disk,
floppy disk and streamer

Data transfer
several standard options for export of quality control data;
CAD data import optional

Network capability TCP/IP network standard built in,
allowing remote access for diagnosis, service and
software maintenance

Overall dimensions 58 x 100 x 150cm WxDxH
Line requirements 100 - 260VAC, 50 - 60Hz, 3kW, single phase
Air I vacuum 5 bar 550 mm/Hg

Material Input
Substrate size 200 x 150mm maximum
Substrate types Leadframes, PCBs, boats, carriers etc.

Component
Manual, semi-automatic, automatic handling magazine
to magazine or in-line including temperature controller,
3 heating systems optional

Operating Data
Position better than +/-3um typically repeatability
Bond speed 350ms for 2mm loop typically

With rigid heating plates with a width of 170 mm
Working area: 200 x 150 mm
Heated oven/plates
Microscope