1/1
Suss MicroTec CB200 High Pressure Bonding Chamber
Ref :
2629591-9-CP
Condition :
Used
Manufacturer :
Suss MicroTec
Model :
CB200
Short Description :
High Pressure Bonding Chamber
Year(s) :
2012
Quantity :
1
Location :
Seller or machines location:
EUROPE (Western and Northern)
EUROPE (Western and Northern)
Wafer Size Range
Maximum 200 mm
Condition Like New
Other machines similar to Suss MicroTec CB200 High Pressure Bonding Chamber
1
2 Kulicke and Soffa (K&S) 4124 Bonder
Location :
AMERICA North (USA-Canada-Mexico)
1
Kulicke and Soffa (K&S) 4526 Bonder
Location :
AMERICA North (USA-Canada-Mexico)
1
EVG Smartview Bond Aligner
Location :
AMERICA North (USA-Canada-Mexico)
Year(s) :
2005
1
West Bond 7600B 90° Vertical Feed Deep Access Wedge Wire Bonder
Location :
EUROPE (Western and Northern)