Westbond 7400B Wire Bonder

SPECIFICATIONS
MICROPROCESSOR: TI 990,16 Bit
MEMORY: Battery Backup Ram.
DISPLAY: LCD: 40 Character, 3-line, English / Foreign languages.
DATA ENTRY: Digital Switch,0-999.
DEVICE STORAGE BUFFERS: 30
MANIPULATOR: Single-lever X-Y-Z, 8:1 Ratio.
THROAT DEPTH: 6 inches.
WORKING ENVELOPE: 12 inches square x 2.687 inches high.
WORK HEIGHT ADJUSTMENT: 0.625 inches.
WORK PLATFORM: With 6 inch rotary, or without (choice).
WORK HOLDERS: Heated or unheated, interchangeable

FEATURES
MICROPROCESSOR-CONTROLLED machine variables with
dynamic LCD status indicators.
ALL PRE-SET VALUES tracked and displayed with memory for
three device types.
12 INCH WORKING ENVELOPE for large modules or MCMS.
FAULT DIAGNOSTICS.
HEATED and UNHEATED workholders, custom made.
PROGRAMMABLE LOOP and PROGRAMMABLE STITCH
PROGRAMMABLE TAIL/PULL STROKE.
LOAD CELL feedback of bond force values displayed in real time
ENCODED Z AXIS with positional feedback.
8 BIT CONTROL of ultrasonic power and time over any bond.
DETATCHABLE WORK PLATFORM with single-knob, pure
vertical height adjustment (5/8″).
FEATHER-LIGHT and COUNTERBALANCED X-Y-Z mechanism
90 DEGREE DEEP-ACCESS TOOL ASSEMBLY convertible wit
45 degree tool assembly.