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Used Bonder

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1

(CASSETTE LOAD) INCLUDES 6″ CHUCK, JOYSTICK, MONITOR/KEYBOARD (LAST PM WAS IN EARLY 2019 BY MARTEK, VERY GOOD... Location : AMERICA North (USA-Canada-Mexico)

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1x EVG®520 IS Wafer Bonding System - Production Line (up to 150 mm, 1 bond module, manual handling) - Manual... Year(s) : 2022 Location : EUROPE (Western and Northern)

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Bond Alignment Condition: very good Year(s) : 2022 Location : EUROPE (Western and Northern)

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Programmable Digital Ball Bonder. Manages 200 programs with up to six channels per program. Motorized Y axis a... Location : AMERICA North (USA-Canada-Mexico)

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BESI Datacon 2200 EVO Flexible Multi-Chip Die Bonder High accuracy and high productivity Less than 100 operat... Location : AMERICA North (USA-Canada-Mexico)

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Automatic Wedge Bonder Location : AMERICA North (USA-Canada-Mexico)

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Convertible Bonder , Wedge to Ball Location : AMERICA North (USA-Canada-Mexico)

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Wire Pull Bond Tester Location : AMERICA North (USA-Canada-Mexico)

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Wire Pull Bond Tester Location : AMERICA North (USA-Canada-Mexico)

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BT 30 is a die shear tester destruct/non destruct with a built in printer. Location : AMERICA North (USA-Canada-Mexico)

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The Mechel 202 bonder is a pull tester. Location : AMERICA North (USA-Canada-Mexico)

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Power Supply : 99 to 240 VAC Power Consumption : Max 1500 W Power Requirements 240 V Year of Manufacture 201... Year(s) : 2015 Location : EUROPE (Western and Northern)

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Condition Good Weight 1,301 lb (590 kg) Exterior Dimensions Width 42.323 in (107.5 cm) Height 75... Year(s) : 2006 Location : EUROPE (Western and Northern)

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Other Information Power Supply : 100 - 240 V AC Power Consumption : 2,2 KVA Condition Good Year of Manufact... Year(s) : 2004 Location : EUROPE (Western and Northern)

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Condition Good Weight 1,301 lb (590 kg) Exterior Dimensions Width 42.323 in (107.5 cm) Height 75... Year(s) : 2006 Location : EUROPE (Western and Northern)

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Condition Good Weight 1,609 lb (730 kg) Exterior Dimensions Width 28.346 in (72.0 cm) Height 62.... Year(s) : 2015 Location : EUROPE (Western and Northern)

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Condition: Excellent; used in clean room only! Standard X/Y table work area: 12.3" x 7" 2" Wire Spool, motoriz... Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)

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epoxy die bonder Location : AMERICA North (USA-Canada-Mexico)

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Model 8850 Controller Model 10100 Controller Excellent Condition; Lightly Used in Clean Room Environment! Trip... Year(s) : 2018 Location : AMERICA North (USA-Canada-Mexico)

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Deep Access 90° Feed Wedge Wire Bonder Location : EUROPE (Western and Northern)

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Bonder (s/n 12723), which is currently set up with the Wedge Bond Head with 90° Feed Deep Access Clamps, makin... Location : EUROPE (Western and Northern)

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Dispenser with Auto focus Camera Year(s) : 2013 Location : EUROPE (Western and Northern)

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Intel Core2Duo Industrial Desktop PC, Software & Dell 20" HD LCD Monitor, Mouse, Cable & Kit for Dage 4000 Mul... Year(s) : 2011 Location : EUROPE (Western and Northern)

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AL wire Bonders Year(s) : 1999 Location : EUROPE (Western and Northern)

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High Frequency Convertible Automatic Wire Bonder Location : EUROPE (Western and Northern)

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You can find used Bonder on Wotol

The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .

The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT,  572-40, DXB,  505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.

HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays

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