EVG Gemini Automated Production Wafer Bonding System

Max Wafer: 200mm
Configuration: 4 Bonding Chambers, 10 kN Pressure Bonding Capability, Up To 550°C
Fully automated operation
- Interlocked doors with signal light tower
- 4 Axis Industrial Robot
- EVG CIM Framework Software GUI (Graphical User Interface)
- Flexible process flow definition
- Drag and drop recipe programming
- Parallel processing of multiple jobs
- Automated recording of process and machine parameters
- Throughput optimized handling sequence
- Password protected user access levels
- Open cassette loading with empty/present sensor
- Currently configured for 6" (150mm) wafers (4" and 8" optional with additional hardware)
- Qty 8 bond chucks included for 6" wafers, additional chucks can be offered
- SmartView®NT Alignment Module with 5x Objectives
- 4 Bond modules with up to 550°C and 10kN bond force
- Formic Acid Bubbler option for purging formic acid vapor into bond chamber
- 1 purge gas line for process gas
- CE Certified
- System documentation