1/1
NGK FILTECH MEGCON 2 Bonder
Ref :
2629251-9-CP
Condition :
Used
Manufacturer :
-
Model :
NGK FILTECH MEGCON 2
Short Description :
Bonder
Year(s) :
1997
Quantity :
1
Location :
Seller or machines location:
EUROPE (Western and Northern)
EUROPE (Western and Northern)
Condition Fair
Weight 220 lb (100 kg)
Exterior Dimensions
Width 17.717 in (45.0 cm)
Depth 21.654 in (55.0 cm)
Height 57.087 in (145.0 cm)
Serial Number(s) MR96-4009
Other machines similar to NGK FILTECH MEGCON 2 Bonder
1
EVG 501 Wafer Bonder
Location :
AMERICA North (USA-Canada-Mexico)
1
Suss MicroTec CB200 High Pressure Bonding Chamber
Location :
EUROPE (Western and Northern)
Year(s) :
2012
1
Datacon EVO2200 Die Attach Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2007
1
Esec DB 2007 SSI plus Die Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2006