Used Semiconductor Equipment
3,613 resultsSubcategories
• Observation method: Brightfield • Observation method: Darkfield • Observation method: Differential interfere Location : ASIA (North East)
Price : On request
More details• Observation method: Relief contrast (Hoffman phase contrast) • Total magnification: 40x • Total magnificatio Location : ASIA (North East)
Price : On request
More detailsPrecision P5000 Platform Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Cassette to Year(s) : 2001 Location : EUROPE (Western and Northern)
Price : On request
More detailsCondition Good Year of Manufacture 2011 Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsWire Bonders sold in Good working condition Can Power up Initial pass test, Year(s) : 2006 Location : EUROPE (Western and Northern)
Price : On request
More detailsESEC 2005 APLF Soft solder die bonder Still in production Line , Working condition Year(s) : 1987 Location : EUROPE (Western and Northern)
Price : On request
More detailsDie Bonder (E4) Year(s) : 1996 Location : EUROPE (Western and Northern)
Price : On request
More detailscvd: LPCVD/6inch Year(s) : 2018 Location : ASIA (North East)
Price : On request
More details• Column bath temperature range: Room temperature +10°C to 400°C (−50°C to 400°C with liquefied CO₂) • Cooling Location : ASIA (North East)
Price : On request
More detailsCVD: MOCVD Year(s) : 2012 Location : ASIA (North East)
Price : On request
More detailspvd: Sputter/6in Location : ASIA (North East)
Price : On request
More detailsBond Type Thermosonic Ball & Stitch Bond Force Range 20-200 grams X-Y Positioner Range 12" x 5" Axis (X,Y,Z) R Location : EUROPE (Western and Northern)
Price : On request
More details300mm inspection microscope for reflected and transmitted light inspection Nikon stage with 12" x 14" XY trave Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsUltra Micro Hardness Tester Model DUH 202 Location : EUROPE (Western and Northern)
Price : On request
More detailsProber/300mm Year(s) : 2004 Location : ASIA (North East)
Price : On request
More detailsProber Year(s) : 1994 Location : ASIA (North East)
Price : On request
More detailsProber Location : ASIA (North East)
Price : On request
More detailsVOLLAUTOM. FOLIERANLAGE, NITTO - DR - 8500 / PFM3 Wafer Size Range Minimum 150 mm Maximum 200 mm Set Year(s) : 2000 Location : EUROPE (Western and Northern)
Price : On request
More detailsAutomatic Wedge Bonders Condition Good Year of Manufacture 2011 Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsWedge Wedge Wire Bonder Manual bonding ,but it is very good, and look like is very good, machine had caliber Location : EUROPE (Western and Northern)
Price : On request
More detailsBonder is complete and working condition Year(s) : 2014 Location : EUROPE (Western and Northern)
Price : On request
More detailsESEC 3006 F/X bonders - in working condition - no warranty Location : EUROPE (Western and Northern)
Price : On request
More detailsProber Year(s) : 1995 Location : ASIA (North East)
Price : On request
More detailsProber Year(s) : 2001 Location : ASIA (North East)
Price : On request
More detailsProber Location : ASIA (North East)
Price : On request
More detailsYou can find used Semiconductor Equipment on Wotol
For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.