Used Semiconductor Equipment

It utilizes a four-point inline probe head to apply an electrical current and measure voltage drop, calculatin Location : AMERICA North (USA-Canada-Mexico)

Price : On request

The system is the stand alone (T version) operation integrated into an attractive stainless-steel cabinet. The Location : AMERICA North (USA-Canada-Mexico)

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• Measurement Technology: White Light Interferometry (WLI) • Measurement Technology: Vertical Scanning Interfe Location : AMERICA North (USA-Canada-Mexico)

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Can be sold As Is or can be configured to meet your requirements Batch Wafer Processing Etch/Clean - Wet Proce Year(s) : 2004 Location : EUROPE (Western and Northern)

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Wafer size 12 inch Config FI / MainFrame / Process Chamber(2) / AC Box Location : EUROPE (Western and Northern)

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>300mm X 300mm XY Travel Rotating Stage Mounted on Granite Surface Plate Vibration Isolation 2ea DSCDL Positio Location : AMERICA North (USA-Canada-Mexico)

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The 2011 SPEA 4020 Flying Probe is a high-performance fixtureless PCB test system designed for manufacturers Year(s) : 2011 Location : AMERICA North (USA-Canada-Mexico)

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High-Precision Fixtureless Flying Probe Test System for PCB Inspection Key Features • Fixtureless Flying Prob Location : AMERICA North (USA-Canada-Mexico)

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Spares tosell No WaferDiameter 6 Status De-installed Wafer Size Range Minimum 150 mm Maximum 150 mm Set Year(s) : 2007 Location : EUROPE (Western and Northern)

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3 chamber (ICP etch) PT Versaline BCl3 and Cl2 gases which would suggest InP or GaAs or GaN. Wafer size is Year(s) : 2016 Location : EUROPE (Western and Northern)

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Power: 200VAC 50/60Hz 3 Phase 12" Still in the fab running wafers Year(s) : 2014 Location : EUROPE (Western and Northern)

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• Observation Methods: Brightfield • Observation Methods: Darkfield • Observation Methods: Differential Interf Location : ASIA (North East)

Price : On request

Stereozoom with 8:1 zoom ratio 20x/13 eyepieces 1x APO objective Boom stand Fiber ring illuminator Location : AMERICA North (USA-Canada-Mexico)

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• Sensor: 1/2.5" CMOS • Resolution: 1920 × 1080 (1080p Full HD) • Color Depth: 24-bit • Aspect Ratio: 16:9 • F Location : AMERICA North (USA-Canada-Mexico)

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200mm LPCVD furnace tube 1: TEOS/anneal tube 2:Nitride/poly, gas connections: air low N2, N2, FG1, Ar, O2, Si Location : AMERICA North (USA-Canada-Mexico)

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The RA 120M permits scribing of wafers up to 4 inches (102 mm) in diameter and substrates as large as 4 inch Location : AMERICA North (USA-Canada-Mexico)

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last preventive maintenance performed Dec-17-2020 Precision dicing saw for silicon wafers and thin substrates Location : AMERICA North (USA-Canada-Mexico)

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Process: Grind Planarisierer Wafer Size Range Minimum300 mmMaximum300 mm Condition Very Good Year of Manufactu Year(s) : 2015 Location : EUROPE (Western and Northern)

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300mm taiko grinder Three chucks Add on chiller unit /dtu 1531), usv, duct unit, vakuum unit Cassette to Casse Year(s) : 2012 Location : EUROPE (Western and Northern)

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FOCUS Best focus(um) 0.051 AngleX/Y/P/R(u rad) 0.62/4.36/2.64/3.52 Max-Min (um) 0.28 Curvature (um) -0.094 UR- Location : EUROPE (Western and Northern)

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• Rotation speed: Switchable between 150 and 300 rpm • Rotation direction: Counterclockwise • Polishing disc: Year(s) : 2008 Location : ASIA (North East)

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Orthodyne 3600 Plus Wire Bonder - Heavy Ribbon - Z Travel: 50 mm - Theta Travel: +/- 220° - Focus: 30 mm (Prog Location : AMERICA North (USA-Canada-Mexico)

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Metal Etch Etch/Ash/Clean - Plasma Processing Currently Configured for: 200mm Software: Envision 2.0-068 Main Location : EUROPE (Western and Northern)

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Large-format 3D AOI platform for SMT PCB assembly inspection and process control 3D AOI platform for in-line Year(s) : 2012 Location : EUROPE (Western and Northern)

Price : On request

- Single-wafer process - Single rotometer-controlled gas channel - Multi-step process cycle capability - 1 to Location : AMERICA North (USA-Canada-Mexico)

Price : On request