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Used Semiconductor Equipment

3,554 results
1

West Bond Manual Wire Bonder Location : EUROPE (Western and Northern)

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This Mech-El MEI Marpet 1204B Manual Gold Ball Wire Bonder looks to be in good cosmetic condition, showing so Location : EUROPE (Western and Northern)

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This West-bond 7416A Manual Thermocompression Wedge Wire Bonder looks to be in good cosmetic condition, show Location : EUROPE (Western and Northern)

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dry: ICP Etcher/380mm Location : ASIA (North East)

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1

CVD Year(s) : 2008 Location : ASIA (North East)

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1

cvd: LPCVD/DPLOY Location : ASIA (North East)

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Wafer weighing system - Filmthickness Wafer Size Range Set Size 200 mm Accessories Wafer Scale (Mettle Year(s) : 2011 Location : EUROPE (Western and Northern)

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Wafer weighing system - Filmthickness Wafer Size Range Minimum 200 mm Maximum 300 mm Other Informatio Year(s) : 2017 Location : EUROPE (Western and Northern)

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Wafer weighing system - Filmthickness Wafer Size Range Set Size 200 mm Accessories Last Calibration of W Year(s) : 2015 Location : EUROPE (Western and Northern)

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CVD: MOCVD Year(s) : 2010 Location : ASIA (North East)

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3

Grinder Heavy smoker DTU 150 Chiller DVC 010 Vacuum coolant unit Air supply source: Pressure: 0.5-0.8 MPa Location : ASIA (South East)

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Flip Chip Bonder Model FCB3 Year(s) : 2011 Location : EUROPE (Western and Northern)

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Can be set up for dotting or dispense epoxy Year(s) : 2019 Location : EUROPE (Western and Northern)

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Die Bonder Model MCM-12 Year(s) : 2011 Location : EUROPE (Western and Northern)

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coat: TRACK(1C3D) Location : ASIA (North East)

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1

Stepper Year(s) : 1999, 2000 Location : ASIA (North East)

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cvd: LPCVD/TEOS Location : ASIA (North East)

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Configured for Top Side & Bottom Side Alignment (TSA/BSA) EISS 2.0 Enhanced Image Storage System EISS 2.0 Location : AMERICA North (USA-Canada-Mexico)

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1

Signatone S-1160A-5 Manual Analytical Wafer Probe Station. Wafer prober designed to support a broad range of Location : AMERICA North (USA-Canada-Mexico)

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K&S 4522 Manual Gold Ball Wire Bonder With heated work holder. For process development, production, research Location : AMERICA North (USA-Canada-Mexico)

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K&S 4524 Manual Gold Ball Bonder. Versatile production capabilities for bonding applications from simple to Location : AMERICA North (USA-Canada-Mexico)

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1

good condition Location : EUROPE (Western and Northern)

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1

Will be sold in refurbished condition Year(s) : 2000 Location : EUROPE (Western and Northern)

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Nitto De-Taper, sold in working condition Year(s) : 1999 Location : EUROPE (Western and Northern)

Price : On request

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CVD: MOCVD Year(s) : 2010 Location : ASIA (North East)

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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