1/1
Tresky 8" wafer Die Bonder Manual
Ref :
2260991-9-W
Condition :
Used
Manufacturer :
Tresky
Model :
8" wafer
Short Description :
Die Bonder Manual
Year(s) :
-
Quantity :
1
Location :
Seller or machines location:
EUROPE (Western and Northern)
EUROPE (Western and Northern)
Last check :
15 Feb. 2022
Ejector, Partial Heated Stage
Other machines similar to Tresky 8" wafer Die Bonder Manual
1
EVG 501 Wafer Bonder
Location :
AMERICA North (USA-Canada-Mexico)
1
Suss MicroTec CB200 High Pressure Bonding Chamber
Location :
EUROPE (Western and Northern)
Year(s) :
2012
1
NGK FILTECH MEGCON 2 Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
1997
1
Datacon EVO2200 Die Attach Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2007