ASM by DEK

Alignment
> 2.0 Cmk @ ± 12.5 μm (± 6 sigma)
System alignment capability > 2.0 Cmk @ ± 25 μm (± 6 sigma)
Optimum core cycle time8 seconds
Substrate size 50 mm (X) x 40.5 mm (Y) to 620 mm (X) x 508.5 mm (Y)
Operating SystemWindows 7
EmbeddedSqueegee pressure mechanismSoftware-controlled, motorized with closed loop feedback Stencil positioning Semi-auto stencil load with drip tray Understencil cleaning
Interchangeable understencil cleaner (IUSC), fully programmable with wet/dry/vacuum wipe
Adjustable-width stencil mount (AWSM)Frame variants - fully adjustable to accommodate frame sizes in the range of 381 mm to 736 mm
Substrate thickness0.2 mm to 6 mm
Substrate weight (maximum)6 kg
Substrate warpageUp to 7 mm including substrate thickness
Substrate fixture
Over the top clamp
Edge clamp
Foil-less clamp
Vacuum
Temperature & humidity sensorMonitoring of the process environment