Ersa Powerflow e N₂

The ERSA POWERFLOW e N2 is a production-class
wave soldering system designed for high-reliability
through-hole and mixed-technology PCB assembly.
Featuring full-tunnel nitrogen operation,
dual-wave soldering technology, and a modular plug-and-play design,
the system delivers consistent solder quality, improved process control,
and reduced operating costs in
demanding manufacturing environments.

Key Highlights
• Nitrogen-Capable Wave Soldering System
• Full Tunnel Nitrogen Inerting Process
• Lead-Free Production Ready System
• Optimized Chip Wave & Laminar Wave Technology
• Modular Plug-and-Play Construction
• Automatic Tunnel Temperature Compensation
• Large 508 mm (20") Process Width
• Flexible Independent Module Configuration
• Designed for High-Reliability Electronics Manufacturing
• Suitable for High-Mix and High-Volume Production
• Engineered for Consistent Soldering Quality

Technical Overview
• Manufacturer: ERSA
• Model: POWERFLOW e N2
• Year: 2015
• Condition: Original Used
• System Type: Nitrogen Wave Soldering System
• Maximum Conveyor Speed: 3 m/min
• Maximum Working Width: 508 mm (20 in)
• Maximum Top-Side Clearance: 150 mm
• Preheating Length: 1.8 m
• Solder Capacity: 525 – 725 kg
• Wave Configuration: Chip Wave + Laminar Wave
• Nitrogen Operation: Full Tunnel Inerting
• Availability: In Stock

Heating & Process System
• Convection Preheating Technology
• Medium-Wave Infrared Heating
• Short-Wave Infrared Heating
• Automatic Tunnel Temperature Compensation
• Stable Thermal Performance During Production
• Optimized for Consistent Soldering Results

Nitrogen Process Control
• Full-Tunnel Nitrogen Atmosphere
• Reduced Oxidation Throughout the Process
• Improved Solder Joint Quality
• Reduced Solder Bridging Defects
• Minimized Dross Formation
• Enhanced Wetting Performance
• Lower Long-Term Solder Consumption
• Nitrogen Consumption: 25–35 m3/hr

Dual-Wave Soldering Technology
Optimized Chip Wave
• Improves Solder Penetration and Wetting
• Handles Complex Component Geometries
• Reduces Common Soldering Defects
Laminar Wave
• Provides Smooth and Uniform Solder Coverage
• Supports Reliable Through-Hole Soldering
• Enhances Overall Process Consistency

Production Benefits
• Improves First-Pass Yield
• Enhances Solder Joint Reliability
• Reduces Rework and Defects
• Supports High-Reliability Manufacturing
• Maximizes Production Efficiency
• Designed for Continuous Production Environments

Ideal Applications
• EMS & Contract Manufacturing
• Industrial Electronics Production
• Automotive Electronics Assembly
• Aerospace & Defense Electronics
• Power Electronics Manufacturing
• Medical Device Production
• Mixed-Technology PCB Assemblies
• Through-Hole PCB Production

Machine Condition & Availability
• Available Now
• Production-Class Manufacturing Platform
• Additional Photos and Videos Available Upon Request
• Suitable for Immediate Integration into SMT and THT Production Lines