Heller 1809 MKIII Reflow Oven

High-Performance Dual-Lane SMT Reflow System |
Reliable Production-Grade Thermal Processing
A proven industrial reflow solution built for consistent,
high-throughput PCB soldering,
the Heller 1809 MKIII delivers precision thermal control,
efficient energy use, and production stability for modern SMT lines.
With low operational hours and a well-maintained system,
this unit is ready for immediate integration into a manufacturing environment.

Key Highlights
• Designed for high-volume SMT reflow soldering
with stable thermal uniformity across all zones
• Equipped with dual-lane conveyor system for increased throughput
and flexible production flow
• Supports lead-free soldering processes,
meeting modern manufacturing standards
• Built with 9 total heating zones (7 heating + 2 cooling)
for precise temperature profiling
• Industrial-grade reliability with ~30,301 documented operating hours
(single-shift use)
• Clean, well-maintained mesh conveyor system in excellent condition
• USA-assembled Heller engineering platform known for durability
and process stability
• Modern interface with full zone visualization for easy monitoring and control
• Available immediately with no production lead time required

Technical Overview
• Model: Heller 1809 MKIII
• Year: 2014
• System Type: Reflow Oven (SMT Production Line Equipment)
• Heating Zones: 7 Heating Zones
• Cooling Zones: 2 Cooling Zones
• Total Zones: 9 Zones
• Conveyor Type: Dual Lane Edge Rail + Mesh Conveyor
• Power Requirement: 480V Industrial Power
• Operating Hours: ~30,301 hours (single-shift usage)
• Material Compatibility: Lead-free and standard solder processes
• Condition: Fully operational, well-maintained, production-ready
• Industrial Control OS: Windows 7 Professional
• Software Version: 6.2.0.10

Performance & Production Value
• Ensures consistent thermal profiling for high-yield PCB assembly
• Dual-lane configuration increases output without sacrificing precision
• Stable heat distribution reduces defects such as tombstoning and cold joints
• Ideal for mid-to-high volume electronics manufacturing environments
• Efficient system design supports continuous industrial operation