IS-T-300S Selective solder machine

Interselect IS-T-300S Selective solder machine in excellent condition
VIntage 2014

The system IS-T-300 offers proven InterSelect technology and quality from
Germany for entry into selective soldering on an extremely economic base.
This is the challenge we’re facing with a radical design change which also
results in smaller footprint requirements (~1m²) of the machine.
Special care was taken that process-quality-related modules from
the high-end Inline systems such as solder pot, MicroDrop Fluxer and
axis system could be used in this small system.
The integrated Windows 7 PC runs the familiar, user-friendly Software.
Additionally the system already includes one of the best offline solder programming
software, the IS-PhotoScan. The IS-T-300 has a soldering area from 300x300mm and
is able to process PCBs up to 300x500 mm at the same speed (200mm/s) like machines
with way greater demands on the budget.
The ability for remote maintenance reduces service times dramatically so
the customer saves a lot of time and service costs.

Features:
Process-Camera - The live video of the process camera, which shows the nozzle and
the soldering process, is displayed on an additional monitor.
By viewing the video the solder wave can be constantly observed by the user -
including the whole soldering process. This allows the technician or engineer to
adjust the soldering program and important parameters and to observe the
result directly on the monitor.

Wave height control and automatic correction - By using a laser sensor the height of
the solder wave is monitored – and if necessary automatically corrected to
the pre-set wave height.

Solder Level-Sensor - A floater which is monitored by a laser sensor checks on
the solder level. When the solder level drops beyond a predetermined level the
system displays a message right in the machine’s software.

Pump-System - In order to equalize the flow behavior of the solder in
the pump channel and to keep it free of fluctuations this all-titanium pump was
constructed in a special procedure. A particularly quiet,
turbulent-free solder wave is the result.

Pull-Off Feature to avoid Shorts - Especially when soldering connector strips,
or other components where multiple pins can be soldered in a line, shorts can
be formed between the last two pins. Excess solder from the last pin cannot be
dragged to another pin and forms a bulbous solder joint, or worse: a bridge to
the nearby pin. To remove this excess solder the InterSelect systems provide a
"pull-off" solution. Before the solder wave is moved away from the solder joint,
the machine reduces the pump power abruptly. Due to the rapid collapse of
the solder wave, excess solder is withdrawn from the pin and
only the required amount of solder remains at solder joint.

Wettable-Nozzles - For the wettable nozzles the solder is running in all directions,
i.e. all around the nozzle. Solder nozzles from InterSelect are made from a
specially developed metal alloy which have high and persistent resistance even for
lead-free solder alloys. A specially designed nozzle body reduces the formation of
dross (solder slag) by more than 90% and avoids solder balls on the PCB bottom side
far better than conventional nozzle designs.

Automatic Nozzle-Cleaning - Only a clean and oxidation-free solder nozzle can be
wettable. With the integrated cleaning station the InterSelect cleaner is
automatically sprayed onto the nozzle and oxidation residues are removed.

Specifications:
Footprint 1165 X 1030 x 1200 mm (LxWxH)
PCB holder Lenght min-max: 5-500mm
width min-max: 5-300mm
Components above: up to 120mm
components below: up to 40mm
Energy requirements 1 x 230 V
1,3 m3/h N2 @ 99.99% purity
No compressed air Required
Preheating Nitrogen heating
IR heater from 1.5 up to 4.5KW
Solder pot 12KG
Pump unit made of titanium
Pot made of titanium