Koh Young KY-3030VAXL SPI

Koh young KY-3030XVAXL 3D Solder paste inspection.
Vintage 2006

Features:
Hightly reliable and accurate

Specifications:
Performances
Metrology capability Volume, Height, XY position, Area
Defect detection Insufficient, Excessive/ Missing paste, bridging,shape deformity, paste displacement
Field of view size 32 x 24 mm
XY table accuracy 10 µm
Typical load/unload & fiducial find time 4 sec
Height accuracy 2 µm
Repeatability Height: ±1%* Volume: ± 1%*
Min paste size Rectangle: 150 µm Circle: 200 µm
Max paste Height 400 µm
max pcb warp ±5mm
min distance between solders 100 µm
Statistical analysis Histogram, X Bar & S Chart, Cp & Cpk, % gage R&R data, SPI Daily / weekly / monthly repots
Inspection position training Supports GERBER format (274 x, 274D)
Vision algorithm 3D/SFM (Shadow free moiré inferometry)
Operating system Microsoft Windows
probe type No shadow effect
Camera 2M B/W Digital camera (1600 x 1200)
Dimensions (W x D x H) / Weight 1200x1580x1570 mm / 900Kg
Max. PCB size 690 x 610 mm