Koh Young KY-8030L Solder paste inspection

Solder paste inspection system
Vintage 2008

Features:
• True patented 3D volume measurement
• No false calls – no escapes – no shadow problems
• Highest accuracy and repeatability
• No PCB color sensitivity
• Solder paste printing optimization - at its best

Inspection Range
Metrology Capability Volume, Area, Height, Offset, Bridging and Shape Deformity
Types of Defects Insufficient/Excessive/Missing Paste, Bridging,
Shape Deformity and Paste Offset
Measurement Principle 3D Shadow Free Moiré

Camera Technology
Camera 2MPix
XY Pixel Resolution 20 µm
Z Resolution 0.37 µm

Inspection Performance
Inspection Speed at 20 µm Shadow Free Mode 15.0 cm2/sec
High Speed mode 19.7 cm2/sec
Volume Repeatability (on a KY Calibration Target) < 1% at 3 σ
Volume Repeatability (on a PCB) < 3% at 3 σ
Height Accuracy (on a KY Calibration Target) 2 µm
Gage R&R (± 50 tolerance)