Manncorp MC301 Four-Zone Benchtop Reflow Oven

:Key Features
Four independently controlled heating zones
Advanced touchscreen operator interface
Lead-free and tin-lead solder profile capability
Programmable thermal profiles
Closed-loop temperature feedback control
Forced convection heating system
Integrated cooling zone
Real-time profile graphing and monitoring
Compact benchtop footprint
Suitable for prototype through low-volume production
Excellent for PCB assembly, electronics manufacturing, engineering labs, and product development environments

Applications
The Manncorp MC301 is ideal for:
SMT PCB assembly
Electronics manufacturing
Contract manufacturing (EMS)
Prototype production
Product development laboratories
Engineering and research facilities
Aerospace electronics
Medical electronics
Military and defense electronics
Industrial controls manufacturing
University engineering programs
Process development and thermal profiling

Advanced Thermal Control
The MC301 utilizes a sophisticated four-zone heating architecture designed
to accurately manage the critical stages of the reflow process:

Zone 1 – Preheat
Controlled ramp-up to prevent thermal shock and component stress.

Zone 2 – Soak
Stabilizes assembly temperatures and activates solder flux.

Zone 3 – Reflow
Achieves solder liquidus temperatures for reliable interconnect formation.

Zone 4 – Cooling
Controlled cooling minimizes thermal stress and promotes consistent solder joint quality.

The touchscreen interface allows operators to create, save,
modify, and recall process recipes for a wide variety of
PCB designs and solder paste formulations.

User-Friendly Touchscreen Interface
The integrated color touchscreen provides:
Real-time process monitoring
Profile editing
Temperature graphing
Recipe storage
Zone control adjustments
Process diagnostics
Lead-free profile management
Operators can quickly switch between stored production profiles,
improving setup efficiency and repeatability.

Typical Specifications
Manufacturer: Manncorp
Model: MC301
Type: Benchtop Reflow Oven
Heating Zones: 4 Independent Zones
Heating Technology: Forced Convection
Control System: Touchscreen PLC Interface
Profile Storage: Multiple Saved Profiles

Solder Types:
Lead-Free
SnPb

Cooling: Integrated Cooling Zone
Temperature Monitoring: Closed-Loop Feedback
Power: Standard Industrial Electrical Service
Application: SMT Reflow Soldering