Nordson FX-940

3D Inspection
Proprietary megapixel color imaging
Capture on the fly technology
1 top-down and 4 side angle cameras
Quick set-up
High speed
High defect coverage / low false failure
Automated Inspection for:
Solder defects
Lead defects / lifted leads
Component presence and position
Correct part / polarity
Through-hole parts
Co-planarity of chips, BGAs and other height sensitive devices
Power: 110-220VAC, 50/60 Hz, 15 amps
Air input: 60 PSI min., 1/4” air hose, 2 CFM
Footprint: 39” x 52” x 60” (1000mm x 1329mm x 1531mm)
Weight: 1050 lbs (430 kg)