Philips Topaz

Placement Speed:
Rated up to ~14,000 CPH (Topaz‑X)

Head Configuration:
Single beam with 4 “flying nozzle change” heads +
4 standard heads SMT

Component Toolbox:
Small: 0201, 0402 passive chips up to QFP, PLCC, BGA, CSP SMT Resource+11ibesmt.com+11Scribd+11
Capable of 32mm package sizing, minimum 0.4–0.5 mm QFP pitch
Dark bottom BGA and μBGA support with ball pitch 0.75 mm and
ball diameter 0.3 mm Scribd+1Exapro+1

Accuracy:
Chips/SOIC: ±80 µm (3σ)
QFPs: ±60 µm to ±40 µm depending on head and camera Scribd+2ibesmt.com+2Exapro+2Exapro+1Scribd+1
Rotation accuracy: 0–360° in 0.01° steps

Vision System:
On‑the‑fly line sensor camera (front), optional rear camera ibesmt.com+1Scribd+1
Area CCD camera available for fine-pitch components and
fiducial checks caeonline.com+7ibesmt.com+7Scribd+7

Feeder System:
Up to ~90–100 tape feeder slots (8 mm, 12–56 mm widths)
plus stick/tray feeders Scribd+1Exapro+1
Quick-change feeder trolley or FES carts available eBay+7smtnet.com+7SMT Resource+7

PCB Handling:
Adjustable conveyor width up to 460 × 440 mm standard
(some support 646 × 457 mm) Exapro+1caeonline.com+1
Board height capacity up to ~18.5 mm on some variants

Mechanical Design:
Rigid, vibration-resistant frame; servo-driven axes (accel ~6 m/s²)
caeonline.com

Software & Control:
Windows-based OS (NT up to 2000/XP era) with VICS‑2500 vision,
GUI control, SMEMA interface Scribd
On-board monitoring: provides component placement feedback
and diagnostics caeonline.com+1Scribd+1

Feature Specification
Head Setup 4 flying
Max Placement Speed 14,000
Component Range 0201 up to 32 mm, including BGAs
Placement Accuracy (3σ) ±40–80 µm
Vision Line sensor + area CCD options
Feeder Capacity 90–100 slots + tray/stick feeders
PCB Size Up to ~460 × 440 mm
Component Height Up to ~18.5 mm
Alignment & Software VICS‑2500 vision, SMEMA, Windows GUI

This machine comes with feeder carts