Royce Autoplacer MP300 for wafers up to 200mm

Royce Instruments MP300 Autoplacer
Manufacture Date 2016
Maximum 200mm wafer (motorized xy stage has 8x8 travel)
includes 3 die pickup assemblies
All manuals and software included
Windows 7 PC with Die Sort Manager Version 4.1.6270.18882

Specifications:
Electronic wafer mapUp to 16 x 2 inches (50mm) waffle pack or Gel-Paks
Quad needle eject head, up to 3 mm eject height
Die size from approx. 0.76 “ 25.6 mm square

Standard soft surface contact vacuum pick up
Microscan DOAL® (Diffuse On-Axis Light) illuminator provides diffuse,
uniform illumination for flat specular surfaces.
With the coaxial lighting approach, specular surfaces perpendicular
to the camera appear bright, while surfaces surfaces which are
marked or embossed absorb light and appear dark.
By providing greater uniformity than conventional sources,
DOALs increase machine vision accuracy and repeatability.
Smart Series Technology: Built-in controller with continuous and
high output strobe modes

Provides superior uniformity throughout the illumination envelope
Passively cooled
The ability to process die using either wafer maps or ink dot recognition.
The Die Sort Manager has an extensive library and
can accommodate the latest software formats as
well as the many older/legacy wafer map formats.
The quick change flexibility makes it ideal for
volumes from a few prototype wafers to high volume production.
Micron level control of the die ejection enables the
handling of die as thin as 50 microns without damage.
Die pick-up and handling include the conventional vacuum pick-up
and also a unique non active surface handling technology
which allows the sorting and placement of fragile die such as
GaAs die with air bridges, MEMS, microfluidics, Lab-on-Chip,
biochips, optoelectronics and inkjet heads.
Allows transition from one wafer size to another whether larger
or smaller, or to a completely different format to allow
full utilization of downstream equipment and processes.
This is particularlyimportant when picking die from
multi-project wafers, the so called “Pizza Wafers.”
Customer or device specific parameters are easily stored
and maintained to allow easy recall andimplementation
of proven programs at a later date to ensure the reliable
and repeatable processing of all die.
The fully automated process will sort and bin entire wafers
without operator input allowing 100%die traceability.
For MEMS type devices where the die surface cannot be
touched the MP300 utilizes a custom gripper which
can pick up the die from the sides and
whose force is fully adjustable between 0 to 20 grams.