Used Semiconductor Equipment

Grid electron microscope Resolution: 1,8 nm at 1kV or 0,5 nm at 30kV Magnification: Low magnification mode: 6 Year(s) : 2001 Location : EUROPE (Western and Northern)

Price : On request

Stepper Model 1600 Year(s) : 2001 Location : EUROPE (Western and Northern)

Price : On request

Precision dicing saw SEM and TEM Location : EUROPE (Western and Northern)

Price : On request

NOVELLUS, INOVA NEXT, 300mm Tool ID: MDX2951 Year(s) : 2013 Location : EUROPE (Western and Northern)

Price : On request

Inspection: Wafer Maker KLA-Tencor Model Altair 8900 Year(s) : 2014 Location : ASIA (North East)

Price : On request

TCDEV-26 TEL ACT 8 COATER/DEVELOPER (ex CTDV-A19) Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

[Light probe measurement] - Measurable range (XY): 90 x 90 mm - Maximum measurement depth: 30 mm - Light probe Location : ASIA (North East)

Price : On request

TCDEV-30 TEL ACT 8 COATER/DEVELOPER(former CTDV-A17) TEL ACT8, 200mm Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

TRACK TEL ACT8 200mm Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Manual wafer load substrate bonder Capable of fusion compression bonding Capable of thermal compression bondin Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Thin film measurement tool Broadband UV optics Dual beam spectrophotometry Wafer sizes: 100mm, 150mm, and 200m Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Manual wafer load substrate bonder Set up for fusion compression bonding, thermal compression bonding, and an Location : AMERICA North (USA-Canada-Mexico)

Price : On request

The Oxford Plasmalab 100 is a modular plasma processing system. It can be configured to carry out Reactive I Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wafer sorter for 300mm wafer Version: 300mm De-installed, warehoused. Can be inspected by appointment. 2 port Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Mask Aligner with CIC1000 lamp housing Version: 200 mm The machine was in working condition up until it was Year(s) : 2019 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

AOI System Type: 3D AOI Year(s) : 2014 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

AOI System Type: 3D AOI Year(s) : 2014 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Laser Marking Machine (2016) Brand: CTI Systems Model: MS2B-10W/CO2-2-1M-4008 Laser Power: 10W Year(s) : 2016 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

FEATURES - HYBOND Soft TouchTM energy system. - Front panel ultrasonic test button. - Deep vertical access of Location : AMERICA North (USA-Canada-Mexico)

Price : On request

552 is a wedge bonder with thermocompression Location : AMERICA North (USA-Canada-Mexico)

Price : On request

572 is a Vertical Feed Ultrasonic Wedge/ Wire Bonder Location : AMERICA North (USA-Canada-Mexico)

Price : On request

UV LC-6 Benchtop Conveyor UV Curing System. Lamp can be rotated and set to any angle to part travel or raised Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Model 365 Capabilities: Cures most UV tape in 5 seconds Large exposure area cures up to 300mm wafers. Location : AMERICA North (USA-Canada-Mexico)

Price : On request

7372E Convertible Epoxy/Eutectic Die Bonder. Unlimited deep reach access to remote bond targets on large packa Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Variable Speed Grinder Polisher. Polishing Wheel: 8”. Variable speed from 50 to 500 rpm. LED display. Constant Location : AMERICA North (USA-Canada-Mexico)

Price : On request