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Used Semiconductor Equipment

3,570 results
1

Wire Bonders (U22) (U21) Year(s) : 1995 Location : EUROPE (Western and Northern)

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Orthodyne 360B Heavy wire bonder Y1991 5 to 20 mils (Sold) Orthodyne 360B Wire bonder Y1991 1mil (Available as Year(s) : 1991 Location : EUROPE (Western and Northern)

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1

This West-Bond 7700C Thermosonic Ball-Wedge Wire Bonder looks to be in good cosmetic condition, showing some Location : EUROPE (Western and Northern)

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1

Prober Year(s) : 1998, 2000 Location : ASIA (North East)

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1

Prober Year(s) : 2000 Location : ASIA (North East)

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Prober Year(s) : 2004 Location : ASIA (North East)

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1

atmospheric wafer robot for KLA Version: 300 mm Location : AMERICA North (USA-Canada-Mexico)

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1

Used, looks complete, very clean Year(s) : 1993 Location : EUROPE (Western and Northern)

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1

Nissin Exceed 2000 Ion Implanter System Dimensions: 3000W X 6325D X 2500H cm Wafer Size: 75-100mm Energy Rang Year(s) : 1997 Location : EUROPE (Western and Northern)

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1

Condition Good Year of Manufacture 2010 Year(s) : 2010 Location : EUROPE (Western and Northern)

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1

Dicing Saws Condition Good Year(s) : 2011 Location : EUROPE (Western and Northern)

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Automatic Wedge Bonders Condition Good Year of Manufacture 2011 Year(s) : 2011 Location : EUROPE (Western and Northern)

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This Hybond 45° Feed Thermosonic Wedge Wire & Ribbon Bonder looks to be in good cosmetic condition, showing s Location : EUROPE (Western and Northern)

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This Hybond 522 Gold Ball Wire Bonder looks to be in good cosmetic condition, showing some minor signs of wea Location : EUROPE (Western and Northern)

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1

This West-Bond 747677B is a Three-Way Convertible 45° Wire Feed Wedge, 90° Wire & Ribbon Feed Wedge, and Ball Location : EUROPE (Western and Northern)

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Prober Year(s) : 2003 Location : ASIA (North East)

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1

• Type: Mask aligner • Power Supply: 1000 W • Resolution: 1 micron on 6″ wafers • Microscope: Split-field type Location : AMERICA North (USA-Canada-Mexico)

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• Minimum Inspection Component Size: 01005" (0.4 × 0.2 mm) (10 µm resolution) • Positioning Accuracy: Pixel-re Location : EUROPE (Western and Northern)

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line, 8.125mm, direction right to left Year(s) : 2010 Location : EUROPE (Western and Northern)

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1

Automatic Wedge Bonders Condition Good Year(s) : 2010 Location : EUROPE (Western and Northern)

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1

Dicing Saws Condition Good Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

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1

Automatic Wedge Bonders Condition Good Year(s) : 2010 Location : EUROPE (Western and Northern)

Price : On request

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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