Used Semiconductor Equipment

Measurement: Film thickness/6in Year(s) : 2020 Location : ASIA (North East)

Price : On request

Inspection: Thermawave Year(s) : 1998 Location : ASIA (North East)

Price : On request

Laser Marking System Marking Field (mm): 350x350 Machine configuration: Transport height: 920 mm ± 50 mm Int Year(s) : 2016 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Completely maintained Scanning Electron Microscope with IXRF EDS detector included Location : AMERICA North (USA-Canada-Mexico)

Price : On request

The Spin Rinse Dryer is used for rinsing and drying substrates. Max. size: 8" low profile, NOT Aus on the fro Year(s) : 2017 Location : EUROPE (Western and Northern)

Price : On request

- The Spin Rinse Dryer is used for rinsing and drying substrates up to 12" round or 7" rectangular. - Safety Year(s) : 2015 Location : EUROPE (Western and Northern)

Price : On request

West Bond 353637E-90 Automatic, Gantry, Large Area, Triple-Convertible Wire Bonder. Currently configured for Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Semi auto wafer mounter to mount dicing tape and backgrind tape. Condition Excellent Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

HIO process , 200mm, S/N M860260 Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wet Process Equipment 200mm Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

AOI for rigid panel or flex reel to reel feed, rigid panels max panel size 515mm x 515mm. Year(s) : 2019 Location : EUROPE (Western and Northern)

Price : On request

Spindle Type Air Bearings External Cooling Water Cooled Condition Good Exterior Dimensions Width 551.181 in Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

Condition: very good Developer with 2 chambers for spray developing. Wafer Size Range Minimum 150 mm Maxi Year(s) : 1996 Location : EUROPE (Western and Northern)

Price : On request

Condition Refurbished Heated bondhead Wafer strecher Flip unit Tool bank Year(s) : 2012 Location : EUROPE (Western and Northern)

Price : On request

Still installed - Warm shutdown. Working Condition. Wafer : 8 Inches. Vintage : 2008. It's complete with HDD a Year(s) : 2008 Location : EUROPE (Western and Northern)

Price : On request

- Type II - EDX 1) Performance Resolution: - 1.5 nm guaranteed (at accelerating voltage 15 kV, working distan Year(s) : 1997 Location : EUROPE (Western and Northern)

Price : On request

Plasma Processing Equipment and Tools, 200mm, s/n: 3715 Year(s) : 1996 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Critical Dimension Scanning Electron Microscopes, 300mm, s/n: U-666 Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Chemical Vapor Deposition Equipment 300mm Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Accessories 3 monitors Condition Good Year of Manufacture 2008 Year(s) : 2008 Location : EUROPE (Western and Northern)

Price : On request

Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Process Capabilities 4 Chamber Sys Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

Particle counter for transparent wafer 6 Inch As is cold down Was working before de-install, Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

De-installed. All functions were checked before de-installation. Model: Accretech UF3000Ex Vintage:2012.10 Te Year(s) : 2012 Location : EUROPE (Western and Northern)

Price : On request

Centura TCCP – TAN Ox Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Thin Films measurement tool, 8300 XSE Film Thickness Analyzer, Semi Automatic loader (150, 200, and 300mm wafe Location : AMERICA North (USA-Canada-Mexico)

Price : On request