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Used Semiconductor Equipment

3,629 results
1

Heavy Wire Bonder like new. Modifications possible upon request. Location : EUROPE (Western and Northern)

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1

Etcher Type Box Rated Power Output 5000 Watts Reactor Center Rectangular Reactor Center Size Width 30.00 in ( Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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1

Applied Materials Axiom HT plus Axiom HT+ strip chamber Year(s) : 2007 Location : EUROPE (Western and Northern)

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1

Fully Automatic Dicing Saw Status: excellent Application: Dicing/Cutting/Slotting various wafers X - axis Sec Location : EUROPE (Western and Northern)

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Fully Automatic Dicing Saw Status: excellent Application: Dicing/Cutting/Slotting various wafers X - axis Sec Location : EUROPE (Western and Northern)

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1

assy: Plasma Cleaner Year(s) : 2020 Location : ASIA (North East)

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Manufacturer: FriesResearch & Technologie GmbH The MicroProf ® is the universal surface metrology tool for q Year(s) : 2014 Location : EUROPE (Western and Northern)

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Specifications: Accuracy: +/- 0.005 mm Measuring Range: 8” x 4” stage Includes: Certificate of Calibration MX Year(s) : 2018 Location : AMERICA North (USA-Canada-Mexico)

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1

Like New Including Heated work Holder Year(s) : 2023 Location : EUROPE (Western and Northern)

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film thickness from 100A to 50 microns Upgraded to new Olympus MS Plan infinity corrected 5x/10x/50x objective Location : EUROPE (Western and Northern)

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1

Max. workpiece size: 8"/ square die 200mm X-axis: Cutting range: 210mm Cutting speed: 0.1 ~ 300m/s Y-axis: Year(s) : 2018 Location : EUROPE (Western and Northern)

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Prober Year(s) : 1991 Location : ASIA (North East)

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1

Calypso Software – 2016 Version 6.2.12 Computer (Windows 7), monitor, & keyboard Multi Color Ring Light 4th Ax Year(s) : 2014 Location : AMERICA North (USA-Canada-Mexico)

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1

• Software: MeasureMind 3D • Software Version: 13.06.54 • Computer: included • Operating System: Windows XP • Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

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1

Accuracy: XY: 3.5 + L/125 Z: 7.0 + L/100 Measuring Range: X-axis 18” Y-axis 18” Z-axis 6” Location : AMERICA North (USA-Canada-Mexico)

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• System Type: manual probe system • Application: DC testing • Application: CV-IV testing • Application: high- Location : AMERICA North (USA-Canada-Mexico)

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1

• Deposition Sources: two low-voltage thermal evaporation sources • Pump Type: built-in turbo molecular pump • Location : AMERICA North (USA-Canada-Mexico)

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1

The tool was recently dismantled and is stored in a warehouse Location : EUROPE (Western and Northern)

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1

Wedge-wedge, Bondhead 60° e-box Year(s) : 2019 Location : EUROPE (Western and Northern)

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1

GOCu-Ball Bonder Year(s) : 2016 Location : EUROPE (Western and Northern)

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1

CU kit Copper Bonder Year(s) : 2016 Location : EUROPE (Western and Northern)

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1

Wedge-wedge, Bondhead 60° e-box Vers. 2 Year(s) : 2014 Location : EUROPE (Western and Northern)

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1

Long Scan Surface Profilometer Wafer Size: 8"/200mm Note: this tool won’t boot Year(s) : 1990 Location : EUROPE (Western and Northern)

Price : On request

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1

Compatible with a rectangular probe card with vertical probe (255mm x 114mm) - compatible CE marked or able t Location : EUROPE (Western and Northern)

Price : On request

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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