Used Semiconductor Equipment

Wafer Size Range Minimum 200 mm Set Size 200 mm Power Requirements 208 V 50.0 A 50/60 Hz Year(s) : 1994 Location : EUROPE (Western and Northern)

Price : On request

Wafer Size Range Set Size 200 mm Power Requirements 208 V 80.0 A 50/60 Hz 3 Phase CE Marked Y Year(s) : 1999 Location : EUROPE (Western and Northern)

Price : On request

insp: Liquid-Particle Counter Location : ASIA (North East)

Price : On request

• Resolution: 3 nm at 30 kV • Magnification: Up to 300,000× • Stage: 5-axis motorized • Sample Size: Supports Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

 Wafer Diameter Maximum 12" (300 mm)  Wafer XY Table Travel (13” x 13”) 334 x 334mm  Die Size (10 x 10 mil Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

Still inside crates Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

Process: Die Attach Condition: Working Year(s) : 2010 Location : EUROPE (Western and Northern)

Price : On request

Insertion Machine Model MultiSert Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Plasmatherm Versaline VLN ICP Etcher consisting of: - Manual Load Lock for Single or Multiple Wafers - Si Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Die Bonder Model AD 838 Year(s) : 2013 Location : EUROPE (Western and Northern)

Price : On request

ESEC 2100 FC HS Die Bonder De-installed. It should be complete, so they must go by the photos. Year(s) : 2017 Location : EUROPE (Western and Northern)

Price : On request

 Wafer Diameter Maximum 12" (300 mm)  Wafer XY Table Travel (13” x 13”) 334 x 334mm  Die Size (10 x 10 mil Year(s) : 2003 Location : EUROPE (Western and Northern)

Price : On request

Stepper/6in. Location : ASIA (North East)

Price : On request

• Vacuum Units: 1 (second unit optional) • Press Capacity: 60 tons • Stroke Count: 62,133 • Features: Alarm & Year(s) : 2003 Location : EUROPE (Western and Northern)

Price : On request

Wet process machine Location : EUROPE (Western and Northern)

Price : On request

• Application: Final-stage polishing of hard materials (sapphire, SiC, GaN) • Down-force: High levels applied Location : AMERICA North (USA-Canada-Mexico)

Price : On request

• Wafer Size: 200 mm • Chuck Type: Temperature controlled (no chiller or controller included) • Microscope: Mi Location : AMERICA North (USA-Canada-Mexico)

Price : On request

GE Phoenix Micromex 180 KV PCBA X-ray System DOM: 3/2008 180KVA Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

• AOI microscope • Load Ports: 2 units of Brooks load port • Version: 300 mm • Sales Condition: As is where is Location : AMERICA North (USA-Canada-Mexico)

Price : On request

KLA-TENCOR Opti-2600 Thickness Measurement Year(s) : 1995 Location : EUROPE (Western and Northern)

Price : On request

KLA RS55/TCA Was complete and working condition before de-install Year(s) : 2005 Location : EUROPE (Western and Northern)

Price : On request

This is being sold refurbished with a 3 months parts warranty. Its currently configured with SMIF but can be Year(s) : 1999 Location : EUROPE (Western and Northern)

Price : On request

• Type: Field Emission SEM with EDX • Version: Laboratory • Sales Condition: As is where is • Lead Time: Immed Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

BREAKER SCRIBER (NEW TOUCH SCREEN CONTROLS Location : AMERICA North (USA-Canada-Mexico)

Price : On request

• Speed: 3450 RPM • Function: Tool Grinder / End Mill Sharpener Location : AMERICA North (USA-Canada-Mexico)

Price : On request