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Used Semiconductor Equipment

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1

Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Accessories Spare parts list: see Year(s) : 2001 Location : EUROPE (Western and Northern)

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Dage 2400PC Wire Bond Pull/Ball Shear/Die Shear Tester w/ WP100 Load Cell This Dage 2400PC Wire Bond Pull/Bal Location : EUROPE (Western and Northern)

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Faulty alignment camera. otherwise in good condition. powered down 2 years ago Year(s) : 2010 Location : EUROPE (Western and Northern)

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prober Location : ASIA (North East)

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Laser Repair Location : ASIA (North East)

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CVD: W-CVD/8inch Year(s) : 1999 Location : ASIA (North East)

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Manufacturer Microcontrol Model PFP 6 Description PFP 6 Detaper 408 Wafer Size Range Minimum 150 mm Year(s) : 2003 Location : EUROPE (Western and Northern)

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Spindle Type Air Bearings Maximum Spindle Speed Max 7,000 RPM External Cooling Water Cooled Accessories Year(s) : 2011 Location : EUROPE (Western and Northern)

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Automatic Wedge Bonders Condition Good Year of Manufacture 2010 Year(s) : 2010 Location : EUROPE (Western and Northern)

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KLA Candela CS 20 Wafer Inspection - 1 Phase - 50/60 Hz - 115 V 2007 Vintage Year(s) : 2007 Location : EUROPE (Western and Northern)

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Wafer Inspection Microscope Microscope Type Upright Microscope Configuration Brightfield Illumination Type Ref Year(s) : 2017 Location : EUROPE (Western and Northern)

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Advanced Wafer Inspection, 12" 2007 Vintage Year(s) : 2007 Location : EUROPE (Western and Northern)

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Spindle Type Air Bearings Maximum Spindle Speed Max 70,000 RPM External Cooling Water Cooled Condition Exc Year(s) : 2006 Location : EUROPE (Western and Northern)

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Accessories Spare parts list: see Excel file Robot handler - original (carbon) Motor for SC1 spincup Extend Year(s) : 2009 Location : EUROPE (Western and Northern)

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Condition Good Year of Manufacture 2010 Year(s) : 2010 Location : EUROPE (Western and Northern)

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SUSS MA6 MASK ALIGNER consisting of:  - Model: MA6/BA6 - Manufacturer: Suss MicroTec / Karl Suss - Wafer Size: Location : AMERICA North (USA-Canada-Mexico)

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Wire bonder Model 1488.0 Year(s) : 1999 Location : EUROPE (Western and Northern)

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Still installed in Nano Laboratory Year(s) : 2012 Location : EUROPE (Western and Northern)

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1

Complete and in working condition Year(s) : 2008 Location : EUROPE (Western and Northern)

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1

Wire Bonders (U22) (U21) Year(s) : 1995 Location : EUROPE (Western and Northern)

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Orthodyne 360B Heavy wire bonder Y1991 5 to 20 mils (Sold) Orthodyne 360B Wire bonder Y1991 1mil (Available as Year(s) : 1991 Location : EUROPE (Western and Northern)

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This West-Bond 7700C Thermosonic Ball-Wedge Wire Bonder looks to be in good cosmetic condition, showing some Location : EUROPE (Western and Northern)

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Prober Year(s) : 1998, 2000 Location : ASIA (North East)

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Prober Year(s) : 2000 Location : ASIA (North East)

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Prober Year(s) : 2004 Location : ASIA (North East)

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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