KLA-Tencor CS 920
ASIA (North East)
Wafer Size 6"
Vintage 2014-12
Tool's Condition AS-IS
The Candela CS920 wafer inspection system is designed for
power device manufacturers to provide defect inspection and
accurate process feedback.
This enables the industry to improve SiC substrate quality as well as
the epitaxial growth yields for both SiC epi and GaN-on-silicon processes.
The CS920 enables significantly enhanced yield and reduced time-to-root cause by
integrating surface defect detection and photoluminescence technology
i one inspection platform.
- Optical Head with dual laser and multi-channel detectors.
- Wafer size : up to 200mm (Currently 150mm configured)
- Wafer thickness 350 - 1500 um
- Fully automated cassette-to-cassette wafer handling
- for measurement and analysis of front-surface and buried defect on SiC,
GaN substrate and EPI
(Particle / Scratch / Stain / Carrot/ Stacking fault / Pit / Crack /...)
- 0.06 um defect sensitivity (PSL on Si)
- Photoluminescence
*. To be refurbished.
*. Installed in Clean-room.