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Used Semiconductor Equipment

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1

RTP Location : ASIA (North East)

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Dry etcher/6in Year(s) : 1998 Location : ASIA (North East)

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Spindle Type Air Bearings External Cooling Water Cooled Accessories Sedimentation tank (collection contai Year(s) : 2014 Location : EUROPE (Western and Northern)

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Condition Good Year of Manufacture 2010 Year(s) : 2010 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 200 mm Maximum 200 mm Set Size 200 mm Number of Chambers 1 Process Capabi Year(s) : 2008 Location : EUROPE (Western and Northern)

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Dry etching:RIE equipment Location : ASIA (North East)

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Includes thin wafer handling kit 6" Can be converted to 8" 50/60 Hz 3 Phase 5 Wire 208V Location : EUROPE (Western and Northern)

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Condition Excellent Year of Manufacture 2012 Year(s) : 2012 Location : EUROPE (Western and Northern)

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It’s still installed but no longer under power. It was in Working Condition when decommissioned. Wafer : 8 Inc Year(s) : 2000 Location : EUROPE (Western and Northern)

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Aligner/Double-sided Year(s) : 2001 Location : ASIA (North East)

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Xray Diffractometers 300mm Year(s) : 2014 Location : AMERICA North (USA-Canada-Mexico)

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Plasma Processing Equipment and Tools Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

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TPCC XE+ RP AB: Gate-ox (DPN+RTO);C:Singen Spacer Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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MANUAL LOAD PROBER AUTOMATICALLY PROBES UP TO A 6″ (150mm) WAFER INCLUDES LOW PROFILE TABLE AND STEREO ZOOM OP Location : AMERICA North (USA-Canada-Mexico)

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Dry: ICP Etcher/4in Location : ASIA (North East)

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dry: Etcher/6in. Year(s) : 2020 Location : ASIA (North East)

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Aligner: Mask aligner/4in Year(s) : 2010 Location : ASIA (North East)

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Film Thickness Measurement System Metrology Equipment Date of Manufacture: 2001-12-31 Currently Configured for Year(s) : 2001 Location : EUROPE (Western and Northern)

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Brand: Koh Young Technology Power: 220V a.c Type: 3D SPI FEATURES: - Inspection speed at 0.24sec/FOV - 3D Sha Year(s) : 2011 Location : AMERICA North (USA-Canada-Mexico)

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thermosonic ball bonder with manual Z lever and heated work holder. Location : AMERICA North (USA-Canada-Mexico)

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manual wedge bonder with Z lever and U.S. generator. AUTO TUNE ULTRASONIC GENERATOR INCLUDES CALIBRATED STEREO Location : AMERICA North (USA-Canada-Mexico)

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Condition Good Exterior Dimensions Width 35.433 in (90.0 cm) Depth 47.244 in (120.0 cm) Height 66.92 Year(s) : 2000 Location : EUROPE (Western and Northern)

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ESEC Die Bonder Accessories - Monitors Condition Good Year of Manufacture 2004 Year(s) : 2004 Location : EUROPE (Western and Northern)

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Thin Film Stress Measurement System, 150 mm and 200 mm wafer Location : AMERICA North (USA-Canada-Mexico)

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909 ultrasonic wedge bonder is a simple yet very efficient semi-automatic bonder. It is specifically useful fo Location : AMERICA North (USA-Canada-Mexico)

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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