Used Semiconductor Equipment

CVD: PECVD Location : ASIA (North East)

Price : On request

Dry: ICP Etcher Location : ASIA (North East)

Price : On request

Prober Working condition Vintage circ 1999~2000 MS Dos system EGCommander software Location : EUROPE (Western and Northern)

Price : On request

Manufacture Date: 2006-09-15 HDD Status: Included – With Software Recent Performance Data: NCE X (nm): 31.8 / Year(s) : 2006 Location : EUROPE (Western and Northern)

Price : On request

CUTS UP TO 6” WAFERS SMALL FOOT PRINT, 20” WIDE X 46” DEEP 220V 3PH Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Part No: 99-0339 Model No: A2000LL Diagram No: 99-2884 AURA 2000-LL Non-Copper CE Marked Sold As-Is Installed Location : EUROPE (Western and Northern)

Price : On request

Technical Specification – Etch Tool System Model: LAM Rainbow XL (45xx Series) Specific Model: 4526 XL Process Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

Process: Wet Ox (Pyro) Wafer Size 200mm Location : EUROPE (Western and Northern)

Price : On request

CMP/200mm Year(s) : 2000 Location : ASIA (North East)

Price : On request

Prober Year(s) : 1989 Location : ASIA (North East)

Price : On request

Prober Year(s) : 2006 Location : ASIA (North East)

Price : On request

Burn-in Test System/Memory test Year(s) : 2020 Location : ASIA (North East)

Price : On request

This Mech-El MEI 909 Aluminum Wire Wedge Bonder looks to be in good cosmetic condition, showing some signs of Location : EUROPE (Western and Northern)

Price : On request

2003 Vintage Bonder Year(s) : 2003 Location : EUROPE (Western and Northern)

Price : On request

Kokusai Quixace Ultimate, 300mm, DJ-1236VN-DF Year(s) : 2015 Location : EUROPE (Western and Northern)

Price : On request

Drive System: Dynamic servo drives in X, Y, Z, and P axes Vision System: Datacon image processing system for e Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

PCB X-Ray Inspection desk for Multi-Layer panels before and after drilling. Allows to evaluate the centering e Year(s) : 2015 Location : EUROPE (Western and Northern)

Price : On request

Specifications Applicable Frame Size: 8"/6" Applicable Wafer Size: 8"/6" Applicable Wafer Thickness: 200µm or Location : ASIA (North East)

Price : On request

Pac: Lead Inspection System Year(s) : 2000 Location : ASIA (North East)

Price : On request

Prober Year(s) : 1988 Location : ASIA (North East)

Price : On request

HMI eScan 400 Total -3- Carton DATE OF MFG : 2011/--/--/ 1. EFEM 2. Main Body 3. External Computer Rack Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

Electro Polished Nickel Frame & Modules 2ea ENP Centura Loadlocks for 200mm Wafers Wafer Transfer Chamber with Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

Installed. Unused Since Installation/Qualification It’s in Working Condition. Process Capabilities : Dielectri Year(s) : 2023 Location : EUROPE (Western and Northern)

Price : On request

Mirtec MV-6E AOI System Max board: 18" x 16" 2D Inspection System 10 Mega Pixel Side-View Cameras 15 Mega Pixe Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

8" and 12" tables available. No Missing. Working condition before deinstall. No facility to power on so sel Year(s) : 2002 Location : EUROPE (Western and Northern)

Price : On request