TEL Indy Plus

A large-batch platform for LPCVD oxidation, annealing, and deposition designed to maximize wafer yield per square foot. This series has evolved to include larger wafer batch sizes, low-temperature Atomic Layer Deposition (ALD) applications, and plasma-assisted deposition (TELINDY PLUS™ IRad™).

Key Features and Specifications:
Wafer Size: Compatible with 12-inch (300mm) wafers, with options for sizes from 2" to 6".
Capacity: Equipped with two processing chambers (substrate chamber and
thermal oxidizer chamber).
Temperature Range: Capable of operating at temperatures as high as
and as low as
.
Process: Supports a variety of processes such as etch cleaning, profiling,
and isolated etch for shallow trench isolation (STI).
Safety Features: Includes gas exhaust, baffle isolation, and thermal protection.