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Used Wafer Equipment

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1

INS:Wafer Particle Counter Location : ASIA (North East)

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Details: 120 VAC / 60Hz / 12 AMP Location : AMERICA North (USA-Canada-Mexico)

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Diameter 6.0000 in (152.40 mm) Plating Material Nickel Number of Micropositioners 0 Location : AMERICA North (USA-Canada-Mexico)

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2300 Exelan Flex EX+ Year(s) : 2011 Location : ASIA (North East)

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TELIUS Wafer Size 12 Year(s) : 2004 Location : ASIA (North East)

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μ-Asher Wafer Size 8 Location : ASIA (North East)

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Unity lle 85DI Wafer Size 8 Year(s) : 1998 Location : ASIA (North East)

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Unity ME 85 SCCM Year(s) : 2005 Location : ASIA (North East)

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IINDY-B-L Wafer Size 300 Year(s) : 2006 Location : ASIA (North East)

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P-12XLM Wafer Size 300mm Year(s) : 2006 Location : ASIA (North East)

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FPA-3000i5 Wafer Size 8 Year(s) : 1996 Location : ASIA (North East)

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AMC7821 Wafer Size 6 Year(s) : 1983 Location : ASIA (North East)

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AMC7821 Wafer Size 6 Year(s) : 2001 Location : ASIA (North East)

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AMC7811 Wafer Size 6 Year(s) : 1990 Location : ASIA (North East)

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Endura CL Wafer Size 12 Year(s) : 2000 Location : ASIA (North East)

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COMPASS 300 Year(s) : 2000 Location : ASIA (North East)

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Wafer Size 5 Year(s) : 1996 Location : ASIA (North East)

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S-9380 Wafer Size 12 Year(s) : 2004 Location : ASIA (North East)

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LITHIUS i+ Wafer Size 8 Year(s) : 2006 Location : ASIA (North East)

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OAPM-400 Wafer Size 5 Year(s) : 1993 Location : ASIA (North East)

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ARCHER XT+ Wafer Size 5,8 Location : ASIA (North East)

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S-9360 Wafer Size 12 Year(s) : 2002 Location : ASIA (North East)

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AIT UV Wafer Size 8 Year(s) : 2002 Location : ASIA (North East)

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Vera SEM 3D Wafer Size 8 Year(s) : 2002 Location : ASIA (North East)

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Wafer Size 6 Year(s) : 1993 Location : ASIA (North East)

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You can find used Wafer Equipment on Wotol

The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics

The main model  MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150,  6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880

HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers. 
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices

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