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Used Wafer Equipment

365 results
1

ACT12, 300mm Will be going to warehouse in May 2023. Tool ID: LATK701 Year(s) : 2004 Location : EUROPE (Western and Northern)

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Innolas Wafermarker Wafermarker C3000DPS Marking for 300mm Wafers Wafer Size Range Minimum 200 mm Maximum 3 Year(s) : 2002 Location : EUROPE (Western and Northern)

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1

wafer Fabrication Year(s) : 1996 Location : EUROPE (Western and Northern)

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1

300mm Year(s) : 2002 Location : EUROPE (Western and Northern)

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1

Manufacturer: Bondztek Model: Bondztek Wafer Mount Wafer Ring Mounter to foton ring Location : EUROPE (Western and Northern)

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1

Complete condition but HDD was removed by former end user See Config file attached Year(s) : 2009 Location : EUROPE (Western and Northern)

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0

Includes: Brush Box Refurbishment, Chemical line replacement, full cleaning and replacement of all wear items Location : EUROPE (Western and Northern)

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1

Leica Inspection & Review – System INS3300 Bridge Tool for 200mm and 300 mm wafers used device Year(s) : 2003 Location : EUROPE (Western and Northern)

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Configuration • 200mm (8-inch), Silicon wafers • 110V, Single Phase, 60 HZ • Tinted Spin Hood • Standard Robot Location : EUROPE (Western and Northern)

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Laser Spike Anneal Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)

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Microscope Type Compound Multiple Objectives Models American Optical Microscope Objectives: 4/.12 Plan ach Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Maximum 150 mm Microscope Type Microzoom X-Y Optics Motion YES Vacuum Chuck Diamet Location : AMERICA North (USA-Canada-Mexico)

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Mask Aligner Vintage: 2010 Condition: very good The machine is then completely refurbished and can also be Year(s) : 2010 Location : EUROPE (Western and Northern)

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Description: Mask Aligner Karl Suss MA 25 (refurbished by expert), up to 5” Wafer or Substrate BSA TSA With v Year(s) : 2000 Location : EUROPE (Western and Northern)

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Mask Aligner is 7″ in diameter lens includes microscope (not shown) and 350 watt lamp. Location : AMERICA North (USA-Canada-Mexico)

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1

Specifications: - Vaporizer - Metal Reduction Kit - AMU Xantrex PS - Parllel Lens NV8250P - oneDoseCup - red Year(s) : 1995 Location : EUROPE (Western and Northern)

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Description Laminator Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Cassette to C Year(s) : 2001 Location : EUROPE (Western and Northern)

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Process Capabilities Poly Year of Manufacture 0 Condition Very Good Location : EUROPE (Western and Northern)

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1

eS32 e-beam wafer inspection 200mm Condition Fair Serial Number(s) 2032 Year(s) : 2006 Location : EUROPE (Western and Northern)

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1

Description: Other Information Wafer Size: 4 to 8" Tape Tension: Programmable Cycle Time: 30 seconds for a 6 Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 100 mm Set Size 100 mm Other Information Chucks:2"-3"-4" Po Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 200 mm Set Size 100 mm Mask Plate Size 5'' x 5'' Alignment Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

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Microscope Type Upright Microscope Configuration Brightfield, Darkfield & DIC Illumination Type Reflected L Location : AMERICA North (USA-Canada-Mexico)

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Description Wafer Backlapping Film Applicator -- 6" Other Information Set up for 6" wafers Power Requiremen Location : AMERICA North (USA-Canada-Mexico)

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1

Substrate Size Up to 380MM Controller Model PCS 102 Resistivity Monitor YES Timer Duration 0-3 hours SRD C Year(s) : 2003 Location : AMERICA North (USA-Canada-Mexico)

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You can find used Wafer Equipment on Wotol

The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics

The main model  MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150,  6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880

HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers. 
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices

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