Ultron UH115-12

• Type: Automatic motor-driven wafer film laminator
• Lamination Method: One-pass uniform film lamination
• Lamination Quality: Bubble-free uniform adhesion
• Crease Control: Crease lines eliminated in lamination area
• Roller Operation Modes: Fast
• Roller Operation Modes: Slow
• Roller Operation Modes: Momentary
• Platen Temperature Control: Digital temperature controlled
• Film Tension Control: Uniform film tension
• Film Tensioner Location: Front film tensioner bars
• Film Tensioner Location: Rear film tensioner bars
• Workstage Height Adjustment: Adjustable from top of unit
• Cutting System: Circular wheel-type cutter
• Cutting Function: Cutting film on film frame
• Cutting Pressure: Adjustable for film thickness and hardness
• Film Type Compatibility: Non-backed film
• Film Type Compatibility: Backed film optional
• Film Orientation: Film wound on outside
• Film Orientation: Film wound on inside
• Roller Speed Control: Adjustable motorized roller speed
• Roller Pressure Control: Adjustable motorized roller pressure
• Roller Assembly: Spring-loaded and easily adjustable
• Alignment System: Adjustable alignment pins
• Alignment System: Vacuum cups
• Film Frame Compatibility: Accepts all film frames
• Film Separation: End cutter
• Maximum Wafer Size: Up to 12 inch wafer capability