Karl Suss RA120M Automatic Scriber for GaAs and sensitive materials

The RA 120M permits scribing of wafers up to 4 inches
(102 mm) in diameter and substrates as large
as 4 inches (102 mm) square.

Two independent scribing axes are separately programmable
for maximum versatility.

Parameters can be entered in either microns or mils.
(Inch or metric mode is selected before power up
by positioning an internal mode jumper.)

Data input increments are 1 micron in the metric mode,
and 0.1 mil in inches.
The RA 120M provides three distinct scribing modes
and two separate scribing axes so that you can optimize
the specific configuration best suited to your need.
The choice depends upon the compound being scribed
and the particular device type that is fabricated
on the wafer or substrate.

If the continuous scribe program is selected, the scriber
will produce an uninterrupted scribe across the entire length
of the material, to the depth programmed during setup.
The edge scribe mode allows the RA 120M to scribe
a small distance in from the edge of the material.

The scribe length is operator selectable in 1 micron increments
between 20 and 10,000 microns, and the beginning of the scribe
is always relative to the edge of the material.
When an edge scribe is finished, the table indexes automatically
and the next scribe starts immediately. Therefore this scribe mode
is very fast, since the table only moves a small distance
in the scribing direction.

Skip scribing is very useful for situations where an intersection
of scribes would interfere with proper operation of the device.
In the skip scribe mode, the tool is placed in the scribe position
while the table moves a specific scribe length distance;
the tool is then raised and the table moves a given distance
before the next scribe commences. Parameters are user selectable,
and skip scribes between 20 and 10,000 microns may be programmed.