Kulicke and Soffa (K&S) 7100AD

last preventive maintenance performed Dec-17-2020
Precision dicing saw for silicon wafers and thin substrates up to 200mm diameter
accepts 2"/3" hubbed or annular blades
DC brushless 60,000 rpm air bearing 1.2Kw motor
0.2u resolution
feed rate up to 350mm/s
touch down blade height sensor
Matrox vision system with auto focus and auto illumination
2x-8x zoom
2 arc-sec rotary axis repeatability
200-240v, 50/60hz
software ver. 4.3.2
operating manuals
specify 200mm or 150mm ceramic wafer chuck.