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Rudolph MP200 Contactless metal thickness measurement

Ref : 2597294-9-W
Condition : Used
Manufacturer : Rudolph
Model : MP200
Short Description : Contactless metal thickness measurement
Year(s) : 2006
Quantity : 1
Location : Seller or machines location:
EUROPE (Western and Northern)

Contactless metal thickness measurement
Wafer Size Range
Minimum 150 mm
Maximum 200 mm
Multi-Layer Film Capacity YES
Micro Spot Optics YES
Wafer Mapping YES
Controller Type PC Controller Type
External Cooling Water Cooled
Cooling Water Required Minimum Flow: 0.79 GPM (3.00 l/m) Minimum Temperature: 12 ºC (54 ºF, 285.00 ºK) Maximum Temperature: 20 ºC (68 ºF, 293 ºK)
Operating Air Pressure 14.00 PSI (96,534.20 N/sq m)
Vacuum Required 0.98 in Hg (24.89 mm Hg)
Condition Good

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