Toho FLX-2320-S Thin Film Stress MeasurementSystem
AMERICA North (USA-Canada-Mexico)
Calculation of biaxial modulus of elasticity, linear expansion coefficient, stress uniformity, and file subtraction.
• Trend plotting for Statistical Process Control (SPC).
• Calculation of water diffusion coefficient in dielectric films.• Automatic recalculation of stress when film or substrate thickness is corrected.
• 2-D and 3-D views of wafer topography.
• Plotting of the measured stress-temperature curve