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Used Semiconductor Equipment

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1

8097 MASK ALIGNER 10″ DIAMETER LENS 350 WATT LAMP (CAN BE UPGRADED TO HIGHER POWER FOR ADDITIONAL COST) 4X4″ M Location : AMERICA North (USA-Canada-Mexico)

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with 10″ collimating lenses, for up to 8″ 200mm wafers. * Dual 1000 watt power supplies. * Dual 1000 watt lamp Location : AMERICA North (USA-Canada-Mexico)

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SET UP FOR 2″, 3″ OR 4″ WAFERS INCLUDES SPLIT FIELD OPTICS, 2 TO 3 MICRON RESOLUTION Location : AMERICA North (USA-Canada-Mexico)

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Exposure on 300mm wafers or 12×12″ substrates with up to 1 micron resolution 2000 watt power supply and lamp M Location : AMERICA North (USA-Canada-Mexico)

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- G & H Line Optics - Equipped for 4", 5", 6", and 8" wafers - 1000W Lamp - Extended Focus option for thick re Location : AMERICA North (USA-Canada-Mexico)

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QA-MDI-02 Location : AMERICA North (USA-Canada-Mexico)

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- NSX Automated Wafer Handling System - Xandex 350-0002 Pneumatic Die Marker Controller - Objectives: 1, 2, 5, Location : AMERICA North (USA-Canada-Mexico)

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- Model: NSX-115 Location : AMERICA North (USA-Canada-Mexico)

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- Automated Wafer, Die & Bump Inspection - Objectives: 1, 2, 5, 10, 20x - PC - Monitor - Keyboard and Mouse Location : AMERICA North (USA-Canada-Mexico)

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- ORC UV-MIOA UV Intensity Meter - SN: 19S000005 Year(s) : 2018 Location : AMERICA North (USA-Canada-Mexico)

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Configuration: Fully Automatic Dicing Saw Year(s) : 2009 Location : AMERICA North (USA-Canada-Mexico)

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Strapping Machine Location : EUROPE (Western and Northern)

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Type C 30 F Screw compressor with frequency converter Location : EUROPE (Western and Northern)

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Microscope Type Microzoom Multiple Objectives Models Bausch and Lomb 2.25 X 0.04 N.A. 8 X 0.15 N.A. 25 X 0.3 Location : AMERICA North (USA-Canada-Mexico)

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Inline System 3 Stage Conveyor Max board: 20" x 18" 5 Camera System 10 Mega Pixel Digital Color Camera Precisi Year(s) : 2014 Location : AMERICA North (USA-Canada-Mexico)

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Power: ≤ 30 W. Pulseshape temp.:≥ 10 ns. Pulse to Pulse stability: ± 12 %. Beam divergence: ≤ 0.2 Location : AMERICA North (USA-Canada-Mexico)

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1010B DIE EXPANDER Location : AMERICA North (USA-Canada-Mexico)

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7700 B Pic 3 1Thermosonic ball bonder with optional heated workholder Location : AMERICA North (USA-Canada-Mexico)

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SEM:Scanning electron microscope Year(s) : 1988 Location : ASIA (North East)

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Dry Etch Location : ASIA (North East)

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Excellent operational condition Serial No: F12007JX Year(s) : 2003 Location : AMERICA North (USA-Canada-Mexico)

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Excellent operational condition Serial No: F02088KR Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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7200c epoxy die bonder, LCD display Location : AMERICA North (USA-Canada-Mexico)

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7316C Eutectic Die bonder LCD display Location : AMERICA North (USA-Canada-Mexico)

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Microscope Year(s) : 2020 Location : ASIA (North East)

Price : On request

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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