3 Datacon 2200EVO Flip Chip Bonder
Ref :
2772882-9
Condition :
Used
Manufacturer :
Datacon
Model :
2200EVO
Short Description :
Flip Chip Bonder
Year(s) :
2007
Quantity :
3
Location :
Seller or machines location:
ASIA (North East)
ASIA (North East)
Last check :
04 Feb. 2026
Flip Chip Bonder
Other machines similar to 3 Datacon 2200EVO Flip Chip Bonder
1
Datacon 2200 EVO (gen3) Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2018
1
Datacon 2200 APM Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2003
1
Datacon 2200 EVO Die Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2011
1
Datacon 2200 EVO Die Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2014