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Used Bonder

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1

<b>1x Tosok, DBD4600, Die Bonder Machine Description</b> - Width 49.213 in (125.0 cm) - Depth 86.614 in (... Year(s) : 2004 Location : EUROPE (Western and Northern)

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ASM AB339 Wire Bonder x 2 2 units ASM 339 Eagle in South Korea, working condition till power off from factory Location : EUROPE (Western and Northern)

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Brand: Palomar Palomar Hughes 2460-V Automatic Thermosonic Hybrid Gold Ball Bonder With heated work stage,... Location : AMERICA North (USA-Canada-Mexico)

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ROYCE 550 DIE WIRE BOND PULL TESTER SHEAR SYSTEM Just removed for production, no load cell. condition is... Location : AMERICA North (USA-Canada-Mexico)

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ESEC 3018 AWB Wire Bonder Automated Gold Ball Bonder Type W-131 Flying bondhead operates by means of a fric... Location : AMERICA North (USA-Canada-Mexico)

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ASM Assembly Automation AB559A-06 Rotary Head wedge bonder 2007 Z travel limit : 6mm 180 degree Wire diam... Location : AMERICA North (USA-Canada-Mexico)

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Auto bonder, 8" For advanced MEMS manufacturing and 3D wafer bonding Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

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Dual Head Location : EUROPE (Western and Northern)

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Brand: PVA PVA 2000SF LCD SCREEN OPTICAL BONDING SYSTEM 2012 The PVA2000SF is a flexible robotic platfo... Location : AMERICA North (USA-Canada-Mexico)

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Temperature and Humidity Test Chamber Digital programmable controller and overtemp protection controller. IEEE... Location : AMERICA North (USA-Canada-Mexico)

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- Manual wafer load substrate bonder - Capable of fusion compression bonding - Capable of thermal compression... Location : AMERICA North (USA-Canada-Mexico)

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<b>1x Logitech, 1WBS2, Wafer Bonder Description</b> - Wafer Substrate Bonder - Single Station Wafer Bonde... Location : AMERICA North (USA-Canada-Mexico)

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Consisting of: - Manual wafer load substrate bonder - Capable of fusion compression bonding - Capable of therm... Location : AMERICA North (USA-Canada-Mexico)

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Consisting of: Universal bond chamber control unit Manual load and unload of bond chucks and wafers Ergonomica... Location : AMERICA North (USA-Canada-Mexico)

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Consisting of: - SB6 Substrate Bonder Main System - Varian Turbo Pump and Controller - Operators Manual & Soft... Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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<b>1x, EVG 520IS Wafer Bonder, 2006</b> Semi-automated Wafer Bonding System Single-chamber wafer bonder... Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

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Brand: EVG Model: 520IS UV-NIL Year: 2007 BONDER Specifications - Used - 520IS Bond Chamber for UV Cur... Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)

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Automatic Recognition System Work Plate : Multi Unit Sorting High Speed Automatic Bonding Modify Available for... Location : ASIA (North East)

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Objectives: 10x/21 Includes 1 Workholders Electrical: 110V, 50/60Hz, 1P Location : AMERICA North (USA-Canada-Mexico)

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Includes Mechanical Clamping Heated Workholder 1200D Temperature controller Variable Height P... Location : AMERICA North (USA-Canada-Mexico)

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5

Location : EUROPE (Western and Northern)

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Hybrid Ball Bonder Location : EUROPE (Western and Northern)

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Die Bonder Leadfrme Location : EUROPE (Western and Northern)

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Hybrid Die Bonder Location : EUROPE (Western and Northern)

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TISI ID 151012-167 Manufacturer K&S Model 4522 Description Manual Gold Wire Ball Bonder Location : ASIA (North East)

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