Used Bonder
257 results- PC, Monitor, Keyboard, Mouse - 1000W Lamphouse - Power Supply - Isolation Table - Chuck and Maskholder for... Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details4450 HOT SHOT HOT GAS BONDER WITH STEREO ZOOM OPTICS AND FOCUS MOUNT INCLUDES: HEATED WORKHOLDER Location : AMERICA North (USA-Canada-Mexico)
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More detailsPeristaltic type precision dispenser with hand held needle, adjustable speed with direction reverse, DIGITAL t... Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details4700E Wedge Bonder Can be converted to Ball Bonder Does Not Include Ball Bonder head Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details454630E-79 automatic wire bonder 90 degree vertical feed, motorized. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsEPOXY DIE BONDER WITH NEW COLOR VIDEO CAMERA AND CROSS HAIR Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details2200 evo + Location : EUROPE (Western and Northern)
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More detailsExterior Dimensions Width 30.709 in (78.0 cm) Depth 29.134 in (74.0 cm) Height 70.079 in (178... Year(s) : 2005 Location : EUROPE (Western and Northern)
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More detailsExterior Dimensions Width 53.150 in (135.0 cm) Depth 50.394 in (128.0 cm) Height 69.291 in (1... Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsACB35 WIRE BOND Year(s) : 2000 Location : EUROPE (Western and Northern)
Price : On request
More details8″ (300mm) CHUCK, 8X8″ (300X300mm) TRAVEL, (NEW STEPPER MOTORS AND NEW JOYSTICK) SEMI-AUTOMATIC STEPPING. OPT... Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details4″ ANALYTICAL PROBE STATION WITH B&L ZOOM 7 (20-140X WITH 20X E.P.) 5″ DIAMETER GOLD PLATED CHUCK. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details6″ Manual Prober with Chessman Manipulator Location : AMERICA North (USA-Canada-Mexico)
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More detailsACB400 WIRE BOND Refer to OPC scrap plan (UTC5100 replace ACB35 machine) Year(s) : 2000 Location : EUROPE (Western and Northern)
Price : On request
More detailsExterior Dimensions Width 86.614 in (220.0 cm) Depth 49.213 in (125.0 cm) Height 74.016 in (1... Year(s) : 2016 Location : EUROPE (Western and Northern)
Price : On request
More detailsXYZ Work Cell Dimensions X: 7.00 in (178 mm) Y: 7.00 in (178 mm) Intregrated Vision System YES Resol... Location : AMERICA North (USA-Canada-Mexico)
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More details- PC & Monitor - Keyboard and Mouse Location : AMERICA North (USA-Canada-Mexico)
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More details- Capable of processing up to 6” wafers - Capable of Anodic Bonding - Temperature Control Up to 550 degrees C... Location : AMERICA North (USA-Canada-Mexico)
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More details- Microscope - PC & Monitor - Mouse and Keyboard Location : AMERICA North (USA-Canada-Mexico)
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More detailsBosch Datacon - 2200 APM Location : EUROPE (Western and Northern)
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More detailsDatacon - 2200 EVO Location : EUROPE (Western and Northern)
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More details- Leica S6 Microscope - BS5kg Bondtester Shear Load Cell Cartridge - PC & Monitor - Mouse and Keyboard - Ion G... Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details- PC & Monitor - Keyboard and Mouse Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details- Leica S6 Microscope - PC & Monitor - Mouse and Keyboard Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsCondition Good Weight 1,036 lb (470 kg) Exterior Dimensions Width 275.591 in (700.0 cm) Depth 27... Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsYou can find used Bonder on Wotol
The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .
The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT, 572-40, DXB, 505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.
HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays