Used Bonder
282 resultsUTC2000 Copper Wire Bonder Location : EUROPE (Western and Northern)
Price : On request
More detailsComplete and in working condition Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsexcellent condition, very very few hours of use in a R&D lab. Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More details2008HS3 Plus Die Bonder Location : EUROPE (Western and Northern)
Price : On request
More detailsDie Sorter Bonder Location : EUROPE (Western and Northern)
Price : On request
More detailsASM AD9012 FLIPCHIP 12″ D/A 10 Sets Available Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsMethod: Thermosonic connection of spheroidal wedges Au wire diameter: 18 - 50 µm Diameter of the spool: 5,08 c Location : EUROPE (Western and Northern)
Price : On request
More detailsBond tester Year(s) : 2005 Location : ASIA (North East)
Price : On request
More detailsSpecification: Exposition mode: Manual, semi-automatic of fully automatic Dimensions of the table: 100 mm x 1 Location : EUROPE (Central and Eastern)
Price : On request
More detailsSpecification: Dimensions of the table: 100 mm x 100 mm Height adjustability: 50 mm (max) Range of contact an Location : EUROPE (Central and Eastern)
Price : On request
More detailsSpecification: Au wire diameter: 12,7µm (min) - 76µm (max) Al wire diameter: 20µm (min) - 76µm (max) Bonding f Location : EUROPE (Central and Eastern)
Price : On request
More detailsWAFER BONDER, BONDS RUBBER DISC TO WAFERS UP TO 6″ PRIOR TO DICING, SCRIBING Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsGOLD TIN REFLOW SYSTEM Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsEutectic Die Attach System Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsDescription Analog Manual Wedge Bonder - Leica MZ6 Microscope Accessories Heated/Vacuum Clamp Work Holder Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsManual Ball Bonder Accessories Heated work holder B & L Stereozoom 4 Microscope Magnification: 7X to 30X Sp Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details6 Channels,up to 200 programs, LCD Display Bonding area: 6" x 6" Throat dept: 5.6" Gross table motion: 5.5" Fi Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsDescription Analog Manual Wedge Bonder - Leica GZ6 Microscope Accessories Heated Clamp Work Holder Leica GZ6 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWidth 36.000 in (91.4 cm) Depth 10.236 in (26.0 cm) Height 48.000 in (121.9 cm) Year(s) : 1997 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFeatures Black & White CCTV System Package depth sensor for consistent & precise bond line thickness Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsEV GROUP SMARTVIEW BOND ALIGNER Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsBond Head: 90 Degree Wire Feed Electronic Touchdown Sensing for every bond Programmable Output Ultrasonic Syst Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWafer Size Range Minimum 150 mm Maximum 300 mm Set Size 300 mm Other Information • High resolutio Year(s) : 2005 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsDeep access vertical feed wedge bonder (bonds gold wire, gold ribbon or aluminum wire)20220610 152426 Includes Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsVERTICAL FEED WEDGE BONDER TRUE VERTICAL MOVEMENT DEEP ACCESSG20220214 143050 copy EXTENDED TRANSDUCER LARGE X Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsYou can find used Bonder on Wotol
The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .
The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT, 572-40, DXB, 505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.
HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays