Used Bonder
255 resultsDie Collet Rotation Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details7316A-27 MULTICOLLET EUTECTIC DIE BONDER INCLUDES CALIBRATED REBUILT STEREO OPTICS AND HEATED WORKHOLDER Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSET UP FOR 2″, 3″ OR 4″ WAFERS INCLUDES SPLIT FIELD OPTICS, 2 TO 3 MICRON RESOLUTION Location : AMERICA North (USA-Canada-Mexico)
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More details1010B DIE EXPANDER Location : AMERICA North (USA-Canada-Mexico)
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More details7700 B Pic 3 1Thermosonic ball bonder with optional heated workholder Location : AMERICA North (USA-Canada-Mexico)
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More detailsINCLUDES 1 ROTOR SIZE APPROX 9″, MAX RPM 19,000, 40,000 G DIGITAL CONTROLS Location : AMERICA North (USA-Canada-Mexico)
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More details7200c epoxy die bonder, LCD display Location : AMERICA North (USA-Canada-Mexico)
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More details7316C Eutectic Die bonder LCD display Location : AMERICA North (USA-Canada-Mexico)
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More detailsDie Matrix Expander for 200mm wafers Location : AMERICA North (USA-Canada-Mexico)
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More details7200CR MANUAL PICK AND PLACE BONDER INCLUDES STEREO ZOOM OPTICS EPOXY DISPENSER... Location : AMERICA North (USA-Canada-Mexico)
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More detailsBALL BONDER INCLUDES STEREO ZOOM OPTICS ULTRASONIC GENERATOR AND HEATED WORKHOLDER MANUAL Z LEVER (ALSO AVAILA... Location : AMERICA North (USA-Canada-Mexico)
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More detailsTHERMOSONIC BALL BONDER Location : AMERICA North (USA-Canada-Mexico)
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More detailsEpoxy dispense and chip pickup tool are grouped into one tool assembly which is motor and cam driven to oscill... Location : AMERICA North (USA-Canada-Mexico)
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More details778A BONDER Location : AMERICA North (USA-Canada-Mexico)
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More detailswith Extended Transducer (for bonding on large substrates or pcb's) Includes calibrated stereo zoom 4 With lar... Location : AMERICA North (USA-Canada-Mexico)
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More detailswith soft touch Vertical (deep access) 45 degree feed systems in stock Location : AMERICA North (USA-Canada-Mexico)
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More detailsFront panel operator controls include force, ultrasonic time, ultrasonic energy, tail length, EFO power, and s... Location : AMERICA North (USA-Canada-Mexico)
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More details552 THERMOCOMPRESSION WEDGE BONDER INCLUDES HEATED WORKHOLDER INCLUDES CALIBRATED STEREO ZOOM OPTICS 45 degree... Location : AMERICA North (USA-Canada-Mexico)
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More detailsVERTICAL FEED WEDGE BONDER INCLUDES STEREO ZOOM OPTICS ULTRASONIC GENERATOR MANUAL Z LEVER OR SEMIAUTO MODE EL... Location : AMERICA North (USA-Canada-Mexico)
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More detailsINCLUDES STEREO ZOOM OPTICS ULTRASONIC GENERATOR HEATED WORKHOLDER MANUAL Z LEVER OR SEMIAUTO MODE ELECTRONIC... Location : AMERICA North (USA-Canada-Mexico)
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More detailsWedge Bonder Includes: Calibrated Leica MZ6 Microscope Vertical Feed <b>Spesifications:</b> Good c... Location : AMERICA North (USA-Canada-Mexico)
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More details<b>1x Logitech, BC 3000, Bonder Description</b> This item in good condition and fully operational. The refurb... Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsDie Bonder Location : AMERICA North (USA-Canada-Mexico)
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More detailsGold Ball Bonder Location : AMERICA North (USA-Canada-Mexico)
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More detailsESEC / BESI 2008 Automatic Die bonder Location : AMERICA North (USA-Canada-Mexico)
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More detailsYou can find used Bonder on Wotol
The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .
The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT, 572-40, DXB, 505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.
HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays