Used Bonder
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• Type: Epoxy die bonder • Display: LCD • Optics: Stereo zoom optics • Function: Epoxy dispense • Function: Ro Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMANUAL LOAD PROBER AUTOMATICALLY PROBES UP TO A 6″ (150mm) WAFER INCLUDES LOW PROFILE TABLE AND STEREO ZOOM OP Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsthermosonic ball bonder with manual Z lever and heated work holder. Location : AMERICA North (USA-Canada-Mexico)
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More detailsmanual wedge bonder with Z lever and U.S. generator. AUTO TUNE ULTRASONIC GENERATOR INCLUDES CALIBRATED STEREO Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details909 ultrasonic wedge bonder is a simple yet very efficient semi-automatic bonder. It is specifically useful fo Location : AMERICA North (USA-Canada-Mexico)
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More detailsVERTICAL FEED, HEATED WORK HOLDERS AND HEATED TRANSDUCER OPTIONS Location : AMERICA North (USA-Canada-Mexico)
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More detailsThe aluminum or gold wire size it uses is .7-3 mil The weight of this machine is 60 lbs and the size is 12″ W Location : AMERICA North (USA-Canada-Mexico)
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More detailsmanual wedge bonder Location : AMERICA North (USA-Canada-Mexico)
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More detailsPROGRAMMABLE PULL TESTER LCD READOUT/MENUS STEREO ZOOM OPTICS Location : AMERICA North (USA-Canada-Mexico)
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More detailsultrasonic wedge bonder is a simple yet very efficient semi-automatic bonder Location : AMERICA North (USA-Canada-Mexico)
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More details4523 Wedge Bonder Calibrated Stereo Zoom Optics Included Auto Tune Ultrasonic Generator. Location : AMERICA North (USA-Canada-Mexico)
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More detailsIncludes stereo zoom optics Ultrasonic generator And heated workholder Manual z leve New hmi touch screen logi Location : AMERICA North (USA-Canada-Mexico)
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More details1204B BALL BONDER INCLUDES STEREO ZOOM OPTICS ULTRASONIC GENERATOR AND HEATED WORKHOLDER MANUAL Z LEVER NEW HM Location : AMERICA North (USA-Canada-Mexico)
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More detailsThe MEl 829Z is a thermosonic ball bonder with manual Z lever and heated work holder. Location : AMERICA North (USA-Canada-Mexico)
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More detailsFEATURES - HYBOND Soft TouchTM energy system. - Front panel ultrasonic test button. - Deep vertical access of Location : AMERICA North (USA-Canada-Mexico)
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More details552 is a wedge bonder with thermocompression Location : AMERICA North (USA-Canada-Mexico)
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More details572 is a Vertical Feed Ultrasonic Wedge/ Wire Bonder Location : AMERICA North (USA-Canada-Mexico)
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More detailsThe Model 572 sets the industry standard for ease of operation and maintenance. Front panel operator controls Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsHYBOND’s Model 616 ultrasonic single channel peg bonder has been designed to perform ultrasonic attachment of Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsThe K&S 4123 is a manual wedge bonder that comes with stereo zoom optics. Upgrade to heated work holder. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details4″ probe station 4″ chuck, 4×4″ travel Includes: Microzoom and 2 objectives 80-160x and 250-500x Location : AMERICA North (USA-Canada-Mexico)
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More detailsELECTROGLAS 2001X PROBER MANUAL LOAD WITH 6″ CHUCK FOR UP TO 6″ WAFERS. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPRODUCTION PATTERN PROBE STATION Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsS1000 3″ PROBE STATION Includes B&L Stereo Zoom 4 Optics Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPROBES UP TO 200mm OR 8″ WAFERS. AVAILABLE WITH STEREO ZOOM OPTICS OR HIGH POWER MICROSCOPES (MICROZOOM OR MIT Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsYou can find used Bonder on Wotol
The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .
The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT, 572-40, DXB, 505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.
HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays