Used Bonder
295 resultsWire sizes: Â 1 mil (25 micron) wire standard. Â 0.7 mil (18 micron), 2 mil (51 micron), and 3 mil (76 micron) Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details2100hS Location : EUROPE (Western and Northern)
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More detailse-box; Belt conveyor Location : EUROPE (Western and Northern)
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More detailsNSX-115d1 refurbished to OEM spec WHS200 Handler Location : EUROPE (Western and Northern)
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More detailsBonder handler Location : EUROPE (Western and Northern)
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More detailsWire Bonder offers high acceleration and low vibration and includes a fully ergonomic human-machine interface Location : EUROPE (Western and Northern)
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More details3100 plus Location : EUROPE (Western and Northern)
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More details3100 plus Location : EUROPE (Western and Northern)
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More detailse-box; Manual Workholder 12 x 12" Location : EUROPE (Western and Northern)
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More details3100 optima P4 Location : EUROPE (Western and Northern)
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More details89° Deep Access bondhead. 8x10" adjustable Z height heated workholder Location : EUROPE (Western and Northern)
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More details- MHU - Main Handling Unit w/ Genmark GB8 Robot - Module 1: BA200 – Bond Aligner - Module 2: NP200 – Plasma Ac Location : AMERICA North (USA-Canada-Mexico)
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More details- Manual wafer load substrate bonder - Capable of fusion compression bonding - Capable of thermal compression Location : AMERICA North (USA-Canada-Mexico)
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More detailsMax Wafer: 200mm Configuration: 4 Bonding Chambers, 10 kN Pressure Bonding Capability, Up To 550°C Fully aut Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMax Wafer: 150mm System Dimensions: 36 1/2 x24 1/2 x34 - Manual Wafer Load Mask Aligner - 500W NUV Lamphous Year(s) : 2003 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsXRX-X4 X-Ray System Location : AMERICA North (USA-Canada-Mexico)
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More detailsgold ball bonder with heated workholder Location : AMERICA North (USA-Canada-Mexico)
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More detailsSTM-50K shear (50KG) RPTM-2K rotary bond pull (2KG) RPTM-50 rotary bond pull (50gr) Location : AMERICA North (USA-Canada-Mexico)
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More detailsBonder sn 14691 Location : AMERICA North (USA-Canada-Mexico)
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More detailsDie Bonder Location : AMERICA North (USA-Canada-Mexico)
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More detailsBonder Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSpecs: Wire Diameter Range : Gold - 0.5 to 3.0 mils (12.7 to 76.2 µm) Aluminum - 1.0 to 3.0 mils (25.4 Location : AMERICA North (USA-Canada-Mexico)
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More detailsManual Wire Bonder Location : AMERICA North (USA-Canada-Mexico)
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More detailsworking condition standard configuration Location : ASIA (China - Taiwan - HKG)
Price : On request
More detailswafer size: 200mm excellent working condition Year(s) : 2017 Location : ASIA (China - Taiwan - HKG)
Price : On request
More detailsYou can find used Bonder on Wotol
The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .
The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT, 572-40, DXB, 505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.
HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays