Datacon 2200 evo Wire bonder

Drive System: Dynamic servo drives in X, Y, Z, and P axes
Vision System: Datacon image processing system for edge,
structure, pattern, and ink-dot recognition
Illumination: Independently programmable lighting systems with RGB light
(partially included)
Programming Interface: Menu-driven teach-in programming via
integrated ETX-based industrial PC with graphical Linux user interface (GUI)
Machine Capability: ±10 µm @ 3σ
Substrate Camera: CMOS camera with precision optics
Backside Camera: Included
Wafer Camera: Included
Force Sensor: Force-measurement sensor and Mini-BMC kit
Pickup / Stamping System: With rotary axis 0°–360°, resolution 0.0045°
Application Setup: One application setup for pre-acceptance included

Substrate Transport System
2 x P-Part Automatic substrate transport system (main axis system)

Input / Output System
Input Buffer Substrates cannot be buffered in SMEMA mode
Output Buffer Substrates cannot be buffered in SMEMA mode

Component Feed System
Wafer Table (Without stretcher)
Wafer Lift Including wafer changer

Tool Holder and Tools
Standard Tool Holder Without shank and tip
Pick-and-Place / Adhesive Stamping Tool default version

Punching System
Single Punching System For precise die separation

Condition:
Very good, fully functional