Amadyne Wafer teble with Ejecto Die Bonder Semi Auto
Ref :
2340045-9-CP
Condition :
Used
Manufacturer :
Amadyne
Model :
Wafer teble with Ejecto
Short Description :
Die Bonder Semi Auto
Year(s) :
2013
Quantity :
1
Location :
Seller or machines location:
EUROPE (Western and Northern)
EUROPE (Western and Northern)
Last check :
21 Jan. 2026
Die Bonder Semi Auto Amadyne SAM42
Wafer teble with Ejector: Fluxer; Backside Cam: Tool Holder;
Other machines similar to Amadyne Wafer teble with Ejecto Die Bonder Semi Auto
1
2 Tosok DBD2210 Die bonder
Location :
ASIA (North East)
Year(s) :
2002
1
Tosok GD300 Die bonder
Location :
ASIA (North East)
Year(s) :
1998
1
2 ASM AB356B Bonder
Location :
ASIA (North East)
1
ASM AB356 Bonder
Location :
ASIA (North East)
Year(s) :
1998