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Used Bonder

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1

Heavy Wire Bonder like new. Modifications possible upon request. Location : EUROPE (Western and Northern)

Price : On request

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1

Wedge-wedge, Bondhead 60° e-box Year(s) : 2019 Location : EUROPE (Western and Northern)

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1

GOCu-Ball Bonder Year(s) : 2016 Location : EUROPE (Western and Northern)

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CU kit Copper Bonder Year(s) : 2016 Location : EUROPE (Western and Northern)

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Wedge-wedge, Bondhead 60° e-box Vers. 2 Year(s) : 2014 Location : EUROPE (Western and Northern)

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1

2200 EVO (Gen1) Bonder Year(s) : 2011 Location : EUROPE (Western and Northern)

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2200 EVO (Gen2) Bonder Year(s) : 2014 Location : EUROPE (Western and Northern)

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1

2200 EVO+ Bonder Year(s) : 2019 Location : EUROPE (Western and Northern)

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2200 EVO Bonder double cabin Year(s) : 2018 Location : EUROPE (Western and Northern)

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1

Wedge-wedge, Bondhead 60°, e-box Year(s) : 2008 Location : EUROPE (Western and Northern)

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1

Wire Bonder 45° or 90° Bondhead Year(s) : 2014 Location : EUROPE (Western and Northern)

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1

Wedge, Heavy Wire Your new spare parts system!! (running condition) Location : EUROPE (Western and Northern)

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1

Die Bonder refurbished to OEM spec. Location : EUROPE (Western and Northern)

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1

Die Bonder Semi Auto Amadyne SAM42 Wafer teble with Ejector: Fluxer; Backside Cam: Tool Holder; Year(s) : 2013 Location : EUROPE (Western and Northern)

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1

3100plus and 3100 Optima units have been refurbished according to the manufacturer's specifications. Location : EUROPE (Western and Northern)

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1

BJ920 Wedge Bonder Location : EUROPE (Western and Northern)

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2

Smema; Duples slide fluxer; Ionizer pick: BQC; WMP: Host; Substrate Handler SDH-84fc; SP84 speed; PXRAY; refu Year(s) : 2013 Location : EUROPE (Western and Northern)

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1

ENCLOSED FOR MICROWAVE APPLICATIONS MITUTOYO MICROSCOPE WITH 2 OBJECTIVES SEMI AUTOMATIC, JOYSTICK CONTROL (NO Location : AMERICA North (USA-Canada-Mexico)

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1

772 EPOXY DIE BONDER EPOXY DIE BONDER WITH NEW SYRINGE INCLUDES WORKHOLDER AND STEREO ZOOM OPTICS Location : AMERICA North (USA-Canada-Mexico)

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1

• Operation: Manual • Optics: Split Field • Lamp: 350 W • System: Tabletop, similar to MJB-3 • Substrate Capac Location : AMERICA North (USA-Canada-Mexico)

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1

• Equipment Type: Wire Bonder • Type: Ball Bonder with Negative EFO • Includes: Heated Work Holder • Includes: Location : AMERICA North (USA-Canada-Mexico)

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1

vertical feed ultrasonic wedge bonder. Location : AMERICA North (USA-Canada-Mexico)

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1

• Type: Wire Bonder • Bonding Type: Ball bonder • Optics: Includes stereo zoom optics • Optics Option: Upgrade Location : AMERICA North (USA-Canada-Mexico)

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1

• Type: Wire Bonder • Feed Type: Vertical feed • Options: Heated work holders available • Options: Heated tran Location : AMERICA North (USA-Canada-Mexico)

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• Equipment type: Prober • Condition: Refurbished Location : AMERICA North (USA-Canada-Mexico)

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You can find used Bonder on Wotol

The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .

The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT,  572-40, DXB,  505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.

HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays

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