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Used Bonder

282 results
1

4522 Manual Gold Ball Wire Bonder With heated work holder. For process development, production, research or ad Location : AMERICA North (USA-Canada-Mexico)

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4524 Manual Gold Ball Bonder. Versatile production capabilities for bonding applications from simple to discre Location : AMERICA North (USA-Canada-Mexico)

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WITH BALL BUMP OPTION. INCLUDES HEATED WORKHOLDER AND STEREO ZOOM OPTICS, CURRENTLY BONDS WITH 1 MIL WIRE Location : AMERICA North (USA-Canada-Mexico)

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The SSEC 4400 is a hot gas rework station with non heated workholder Location : AMERICA North (USA-Canada-Mexico)

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Wire Bonder Location : AMERICA North (USA-Canada-Mexico)

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BONDS THREE WAFERS, UP TO 4″ DIAMETER OR PARTS OF WAFERS INCLUDES REBUILT DIRECT DRIVE VACUUM PUMP ULTIMATE VA Location : AMERICA North (USA-Canada-Mexico)

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Choose from heated workholders (clamp or vacuum hold down) Heated transducer option 2″ or half inch spool opti Location : AMERICA North (USA-Canada-Mexico)

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7700E-79 Thermosonic Ball to Wedge Wire Bonder. Wedge Wire Bonder Bonds gold wires ranging from 0.0007” to 0.0 Location : AMERICA North (USA-Canada-Mexico)

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- Wafer Substrate Bonder - Single Station Wafer Bonder - Used For temporary Wax Mounting of Semiconductor Wafe Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

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Heavy Wire Bonder Location : EUROPE (Western and Northern)

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Wire Bonder Location : EUROPE (Western and Northern)

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1

- Windows based with Suss AL 900 / Autoalign System - Alignment System MA200e TSA - PC -Aut. Adjustment ( Cog Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

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709/703 hot gas bonder Includes: New touch screen with recipes Timed parameters: pre scrub, scrub and post sc Location : AMERICA North (USA-Canada-Mexico)

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20 bonder Location : AMERICA North (USA-Canada-Mexico)

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4020 Hot Gas Eutectic Bonder Single hot gas jet, tilting collet, joystick control with stereo zoom optics and Location : AMERICA North (USA-Canada-Mexico)

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Max Wafer: 100mm System Dimensions: main unit 24x42x27 Configuration: 4"/100mm Wafers Max, Topside Align Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)

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WIRE PULL TEST MACHINE Location : ASIA (North East)

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4

Hesse Mechatronics Wire Bonder, Wedge Bonder BJ820 60° Bondhead; e-box; Belt conveyor; Machine is in top runn Year(s) : 2007 Location : EUROPE (Western and Northern)

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Depth (in inches) 24 Width (in inches) 20 Height (in inches) 25 Weight (in pounds) 70.0000 Approximate overall Location : AMERICA North (USA-Canada-Mexico)

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Approximate overall unpacked dimensions: 26"L x 24"W x 24"H Depth (in inches) 26 Width (in inches) 24 Height ( Location : AMERICA North (USA-Canada-Mexico)

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Approximate overall unpacked dimensions: 26"H x 25"W x 29"L Depth (in inches) 26 Width (in inches) 25 Height ( Location : AMERICA North (USA-Canada-Mexico)

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6320 Bonder System There are a few small dings and scratches on the unit. The system powers-up, as shown. I ha Location : AMERICA North (USA-Canada-Mexico)

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The unpacked dimensions of this item are 25“inches x 25“inches x 15“inches Location : AMERICA North (USA-Canada-Mexico)

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C97066 Mech-El 907 / 990 1mil Wire Vertical Feed Wedge Bonder (refurbished) Location : AMERICA North (USA-Canada-Mexico)

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20R Ultrasonic Ribbon Wire Bonder (refurbished) Weight (in pounds) 71.0000 Location : AMERICA North (USA-Canada-Mexico)

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You can find used Bonder on Wotol

The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .

The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT,  572-40, DXB,  505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.

HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays

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