Used Bonder
281 resultsHybond 626 Multipurpose Digital Thermosonic Wire Bonder, Ball Bonder, Wedge Bonder, Bump or Stud Bonder, Peg Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsAutomatic wirebonder Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsF&K Delvotec G5 - Single Bond process Control System BPC2000 Option Deep Access Thin Wire bond head option Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsCondition Good Exterior Dimensions Width 27.559 in (70.0 cm) Depth 27.559 in (70.0 cm) Height Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsExterior Dimensions Width 61.024 in (155.0 cm) Depth 47.244 in (120.0 cm) Height 72.047 in (1 Year(s) : 2008 Location : EUROPE (Western and Northern)
Price : On request
More detailsBonder S/N: 099 117 Vac, 12.1 A, 1 Ph, 50/60 Hz Location : AMERICA North (USA-Canada-Mexico)
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More detailsBonder Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details907 prober has a 4″ analytical probe station with B&L micro zoom optics and two objectives. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsDNS Wafer Size 6 Location : ASIA (North East)
Price : On request
More detailsBonder 4000 Location : ASIA (North East)
Price : On request
More detailsTISI ID 151012-167 Manufacturer K&S Model 4522 Description Manual Gold Wire Ball Bonder Location : ASIA (North East)
Price : On request
More detailsTISI ID 151012-166 Manufacturer K&S Model 4522 Description Manual Gold Wire Ball Bonder Location : ASIA (North East)
Price : On request
More details・Compatible wire diameter: Gold wire 17.5μm to 75μm ・Bonding range: 152-152mm (6 x 6 inches) ・Bonding time: 10 Location : ASIA (North East)
Price : On request
More detailsCondition Very Good Year(s) : 2007 Location : EUROPE (Western and Northern)
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More details117 Vac 12.8 A 1 Ph 50/60 Hz Location : AMERICA North (USA-Canada-Mexico)
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More detailsBonder Model 1484 Location : AMERICA North (USA-Canada-Mexico)
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More details908 6″ Probe Station With High Power Optics Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details920 4″ ANALYTICAL PROBE STATION WITH B&L MICRO ZOOM OPTICS AND 2 OBJECTIVES Also available with B&L Stereo Zoo Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWEST BOND 747677E-79C Combination Bonder capable of Ball Bonding and Wedge Bonding. Bonder comes with two bond Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMA200CC Main System Automatic Mask Aligner Configured for Top Side Alignment Cassette to Cassette Operation Up Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWire Bonder Model IConn ProCu Plus Location : EUROPE (Western and Northern)
Price : On request
More detailsHeavy Wire Bonder Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsBonder Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsBonder Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details4522 Manual Gold Ball Wire Bonder With heated work holder. For process development, production, research or ad Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsYou can find used Bonder on Wotol
The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .
The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT, 572-40, DXB, 505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.
HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays