Dage, Nordson 4600 Bonder

Model: 4600 Mainframe Automated Bondtester
Like New, Used in Lab less than 50 hours!
Installed: 03/2020
Precision shear and pull tests on semiconductor and microelectronic devices
On-board cameras for auto-focus
Manual and Dual Camera-assist Automation
Force Range: Capable of applying forces ranging from 0.01 gf - 50 kgf.
Step back accuracy (force dependent): +/- 0.25μm
System accuracy (force dependent): +/- 0.10% - 0.05 % FSL
Axis travel: 450 mm x 410 mm x 75 mm
XY speed and resolution: Up to 70 mm/s, 100 nm
Z speed resolution: 5 mm/s, 250 nm
Included: Manual, Spare Parts
Fully Functional