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ASM AD-8912 Die Bonder
Ref :
2731342-9-CP
Condition :
Used
Manufacturer :
ASM
Model :
AD-8912
Short Description :
Die Bonder
Year(s) :
2003
Quantity :
1
Location :
Seller or machines location:
EUROPE (Western and Northern)
EUROPE (Western and Northern)
Wafer Diameter Maximum 12" (300 mm)
Wafer XY Table Travel (13” x 13”) 334 x 334mm
Die Size (10 x 10 mil to 1000 x 1000 mil)
Die Placement Accuracy XY (0.38 mil)8.38um
Epoxy Fillet Height (
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