Cyber Optics SE350-L

3D Solder Paste Inspection
Calibration-Free

Specifications
The CyberOptics SE350-L is a 3D Solder Paste Inspection (SPI) system featuring a
Windows XP operating system and a weight of approximately 1,433 lbs.
While the specific details for the SE350-L are not fully provided,
it is part of CyberOptics' line of 3D SPI machines used to inspect and
optimize post-print solder paste placement, utilizing advanced vision technology for
accurate analysis and process control.

Key Features & Technology
3D SPI System:
The SE350-L is designed for 3D solder paste inspection, ensuring high-quality results
by inspecting the precise dimensions and volume of the solder paste.

Advanced Vision Technology:
It uses a series of cameras, an alignment system, and data processing computers to
accurately analyze the solder paste's appearance and volume.

Process Control:
The machine is used for optimizing post-print inspection and providing detailed data for
improving the SMT (Surface Mount Technology) process.

Operating System:
he system is built on a Windows XP operating system.