1/1
Datacon 2200EVO Die Bonder
Ref :
2661640-9
Condition :
Used
Manufacturer :
Datacon
Model :
2200EVO
Short Description :
Die Bonder
Year(s) :
2023
Quantity :
1
Location :
Seller or machines location:
EUROPE (Western and Northern)
EUROPE (Western and Northern)
Machine come with flip-chip configuration which
you could review from the attached photos.
Other machines similar to Datacon 2200EVO Die Bonder
1
Datacon 2200 EVO (gen3) Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2018
1
Datacon 2200 APM Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2003
1
3 Datacon 2200EVO Flip Chip Bonder
Location :
ASIA (North East)
Year(s) :
2007
1
Datacon 2200 EVO Die Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2011